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IRF1404LPbF

International Rectifier
Part Number IRF1404LPbF
Manufacturer International Rectifier
Description Power MOSFET
Published Oct 12, 2015
Detailed Description l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Swit...
Datasheet PDF File IRF1404LPbF PDF File

IRF1404LPbF
IRF1404LPbF

Overview
l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Lead-Free Description Seventh Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
G PD -95104 IRF1404SPbF IRF1404LPbF HEXFET® Power MOSFET D VDSS = 40V RDS(on) = 0.
004Ω S ID = 162A† The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4.
It provides the highest power capability and the lowest possible onresistance in any existing surface mount package.
The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.
0W in a typical surface mount application.
The through-hole version (IRF1404L) is available for low- profile applications.
Absolute Maximum Ratings Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C Continuous Drain Current, VGS @ 10V‡ Continuous Drain Current, VGS @ 10V‡ Pulsed Drain Current ‡ Power Dissipation Power Dissipation Linear Derating Factor VGS EAS IAR EAR dv/dt Gate-to-Source Voltage Single Pulse Avalanche Energy‡ Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt ƒ‡ TJ TSTG Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Thermal Resistance RθJC RθJA Parameter Junction-to-Case Junction-to-Ambient (PCB mounted, steady-state)* www.
irf.
com D2Pak TO-262 IRF1404SPbF IRF1404LPbF Max.
162† 115† 650 3.
8 200 1.
3 ± 20 519 95 20 5.
0 -55 to +175 -55 to +175 300 (1.
6mm from case ) Typ.
––– ––– Max.
0.
75 40 Units A W W W/°C V mJ A mJ V/ns °C Units °C/W 1 03/11/04 I...


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