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KTS101B474K32N0T00

NIPPON CERAMIC
Part Number KTS101B474K32N0T00
Manufacturer NIPPON CERAMIC
Description MULTILAYER CERAMIC CHIP CAPACITORS
Published Oct 17, 2015
Detailed Description MULTILAYER CERAMIC CHIP CAPACITORS Upgrade! Surface Mount Device ?FEATURES 1. Large capacitance by small size. 2. Excel...
Datasheet PDF File KTS101B474K32N0T00 PDF File

KTS101B474K32N0T00
KTS101B474K32N0T00


Overview
MULTILAYER CERAMIC CHIP CAPACITORS Upgrade! Surface Mount Device ?FEATURES 1.
Large capacitance by small size.
2.
Excellent noise absorption.
3.
High permissible ripple current capability.
4.
Pb-free design.
5.
Tin plate terminations.
?APPLICATIONS 1.
Smoothing circuit of DC-DC converters.
2.
On-board power supplies.
3.
Voltage regulators for computers.
3.
Noise suppressor for various kinds of equipments.
4.
High reliability equipments.
?CONSTRUCTION Ceramic Dielectric Termination (Tin Plating) Internal Electrode ?RATINGS 1.
Category Temperature Range 2.
Rated Voltage Range 3.
Rated Capacitance Range 4.
Rated Capacitance Tolerance 5.
Temperature Characteristics 6.
Rated Ripple Current -55 to +125C 25, 50, 100, 250Vdc 0.
033 to 33MF K (P10%) , M (P20%) X5R, X7R See No.
5 on the following table ?SPECIFICATIONS No.
Items 1 Withstand Voltage 2 Insulation Resistance 3 Rated Capacitance Specification No abnormality.
100/CR(MO) or 4000(MO) whichever is less.
Within specified tolerance.
4 Dissipation Factor 5.
0% maximum.
5 Rated Ripple Current Size code 31 32 43 55 Arms 0.
3 0.
5 1.
0 2.
0 Test Condition 250% of rated voltage shall be applied for 5 seconds.
Rated voltage shall be applied for 60P5 seconds at temperature 25P2C.
Temperature Frequency Voltage CR[10MF CR>10MF 25P2C 1P0.
1kHz 120P12Hz 1P0.
2Vrms 0.
5P0.
2Vrms 10kHzK1MHz (sine curve) Ripple voltage Vp shall be less than the rated voltage.
(1/3) CAT.
No.
E1002I MULTILAYER CERAMIC CHIP CAPACITORS Upgrade! ?SPECIFICATIONS No.
Items 6 Adhesion Specification No visible damage.
7 Bend strength of the face plating Appearance : No visible damage.
DC/C : P15% Test Condition Substrate 5N (0.
51kgf) for 10P1 seconds Capacitor The substrate shall be bend by 1mm at a rate of 1mm/s for 5 seconds.
Capacitor Press Press ber Substrate 45P2mm 45P2mm 1.
0mm Support 8 Solderability 9 Resistance to Soldering Heat Min.
75% of surface of the termination shall be covered with new solder Appearance : No visible ...



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