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SiRA14DP

Vishay
Part Number SiRA14DP
Manufacturer Vishay
Description N-Channel 30 V (D-S) MOSFET
Published Oct 18, 2015
Detailed Description www.vishay.com SiRA14DP Vishay Siliconix N-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) () MAX. 0....
Datasheet PDF File SiRA14DP PDF File

SiRA14DP
SiRA14DP

Overview
www.
vishay.
com SiRA14DP Vishay Siliconix N-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) () MAX.
0.
00510 at VGS = 10 V 0.
00850 at VGS = 4.
5 V ID (A) a 58 45 Qg (TYP.
) 9.
4 nC PowerPAK® SO-8 Single D D8 D7 D6 5 6.
15 mm 1 Top View 5.
15 mm 1 2S 3S 4S G Bottom View Ordering Information: SiRA14DP-T1-GE3 (Lead (Pb)-free and Halogen-free) FEATURES • TrenchFET® Gen IV power MOSFET • 100 % Rg and UIS tested • Material categorization: For definitions of compliance www.
vishay.
com/doc?99912 please see APPLICATIONS • High power density DC/DC • Synchronous rectification • Embedded DC/DC G D S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current (t = 300 μs) Continuous Source-Drain Diode Current Single Pulse Avalanche Current Single Pulse Avalanche Energy Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) d, e TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TA = 25 °C L = 0.
1 mH TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C VDS VGS ID IDM IS IAS EAS PD TJ, Tstg LIMIT 30 +20, -16 58 46 19.
8 b, c 15.
8 b, c 130 14.
1 3.
2 b, c 15 11.
25 31.
2 20 3.
6 b, c 2.
3 b, c -55 to 150 260 UNIT V A mJ W °C THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient b, f Maximum Junction-to-Case (Drain) t  10 s Steady State SYMBOL RthJA RthJC TYPICAL 24 3 MAXIMUM 34 4 UNIT °C/W Notes a.
Based on TC = 25 °C.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework conditions: Manu...


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