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SiB412DK

Vishay
Part Number SiB412DK
Manufacturer Vishay
Description N-channel MOSFET
Published Dec 23, 2015
Detailed Description New Product N-Channel 20-V (D-S) MOSFET SiB412DK Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.034 at VGS ...
Datasheet PDF File SiB412DK PDF File

SiB412DK
SiB412DK

Overview
New Product N-Channel 20-V (D-S) MOSFET SiB412DK Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.
034 at VGS = 4.
5 V 20 0.
040 at VGS = 2.
5 V 0.
054 at VGS = 1.
8 V PowerPAK SC-75-6L-Single D 6 D 5 1.
60 mm S 4 1 D 2 D 3 G S 1.
60 mm ID (A) 9a 9a 9a Qg (Typ.
) 6.
14 nC FEATURES • Halogen-free • TrenchFET® Power MOSFET • New Thermally Enhanced PowerPAK® SC-75 Package - Small Footprint Area - Low On-Resistance RoHS COMPLIANT APPLICATIONS • Load Switch, PA Switch and Battery Switch for Portable Devices • DC/DC Converter D Marking Code Part # code AAX XXX Lot Traceability and Date code Ordering Information: SiB412DK-T1-GE3 (Lead (Pb)-free and Halogen-free) G S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Drain-Source Voltage Gate-Source Voltage VDS VGS TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C ID TA = 70 °C Pulsed Drain Current Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IDM IS Maximum Power Dissipation TC = 25 °C TC = 70 °C TA = 25 °C PD Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e TA = 70 °C TJ, Tstg Limit 20 ±8 9a 9a 6.
6b, c 5.
29b, c 20 9a 2b, c 13 8.
4 2.
4b, c 1.
6b, c - 55 to 150 260 Unit V A W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t≤5s Steady State RthJA RthJC 41 7.
5 51 °C/W 9.
5 Notes: a.
Package limited.
b.
Surface Mounted on 1" x 1" FR4 Board.
c.
t = 5 s.
d.
See Solder Profile (http://www.
vishay.
com/ppg?73257).
The PowerPAK SC-75 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework Conditions: manual soldering with a soldering iron i...


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