DatasheetsPDF.com

SQS401EN

Vishay
Part Number SQS401EN
Manufacturer Vishay
Description Automotive P-Channel MOSFET
Published Jan 29, 2016
Detailed Description www.vishay.com SQS401EN Vishay Siliconix Automotive P-Channel 40 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on...
Datasheet PDF File SQS401EN PDF File

SQS401EN
SQS401EN


Overview
www.
vishay.
com SQS401EN Vishay Siliconix Automotive P-Channel 40 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on) (Ω) at VGS = - 10 V RDS(on) (Ω) at VGS = - 4.
5 V ID (A) Configuration PowerPAK® 1212-8 3.
30 mm S 1S 3.
30 mm 2 S 3G 4 D 8D 7 D 6 D 5 Bottom View Part Marking Code: Q005 ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free - 40 0.
029 0.
047 - 16 Single S G FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • AEC-Q101 Qualifiedd • 100 % Rg and UIS Tested • Compliant to RoHS Directive 2002/95/EC D P-Channel MOSFET PowerPAK 1212-8 SQS401EN-T1-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-Source Voltage Gate-Source Voltage Continuous Drain Currenta Continuous Source Current (Diode Conduction)a Pulsed Drain Currentb Single Pulse Avalanche Current Single Pulse Avalanche Energy Maximum Power Dissipationb Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)e, f TC = 25 °C TC = 125 °C L = 0.
1 mH TC = 25 °C TC = 125 °C VDS VGS ID IS IDM IAS EAS PD TJ, Tstg LIMIT - 40 ± 20 - 16 - 16 - 16 - 64 - 26 33.
8 62.
5 20 - 55 to + 175 260 UNIT V A mJ W °C THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT Junction-to-Ambient Junction-to-Case (Drain) PCB Mountc RthJA 81 °C/W RthJC 2.
4 Notes a.
Package limited.
b.
Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
c.
When mounted on 1" square PCB (FR4 material).
d.
Parametric verification ongoing.
e.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK 1212-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
f.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S11-2129 Rev.
...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)