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SQS423EN

Vishay
Part Number SQS423EN
Manufacturer Vishay
Description Automotive P-Channel MOSFET
Published Jan 29, 2016
Detailed Description www.vishay.com SQS423EN Vishay Siliconix Automotive P-Channel 30 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on...
Datasheet PDF File SQS423EN PDF File

SQS423EN
SQS423EN


Overview
www.
vishay.
com SQS423EN Vishay Siliconix Automotive P-Channel 30 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on) () at VGS = - 10 V RDS(on) () at VGS = - 4.
5 V ID (A) Configuration - 30 0.
021 0.
060 - 16 Single PowerPAK® 1212-8 FEATURES • TrenchFET® Power MOSFET • AEC-Q101 Qualifiedd • 100 % Rg and UIS Tested • Material categorization: For definitions of compliance please see www.
vishay.
com/doc?99912 S 3.
30 mm D 8D 7 D 6 Part Marking Code: Q006 S 1S 2 D 5 Bottom View 3.
30 mm S 3G 4 ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free PowerPAK 1212-8 SQS423EN-T1-GE3 G D P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-Source Voltage VDS Gate-Source Voltage VGS Continuous Drain Currenta Continuous Source Current (Diode Conduction)a Pulsed Drain Currentb TC = 25 °C TC = 125 °C ID IS IDM Single Pulse Avalanche Current Single Pulse Avalanche Energy L = 0.
1 mH IAS EAS Maximum Power Dissipationb Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)e, f TC = 25 °C TC = 125 °C PD TJ, Tstg LIMIT - 30 ± 20 - 16 - 16 - 16 - 64 - 22 24 62.
5 20 - 55 to + 175 260 UNIT V A mJ W °C THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT Junction-to-Ambient Junction-to-Case (Drain) PCB Mountc RthJA 81 °C/W RthJC 2.
4 Notes a.
Package limited.
b.
Pulse test; pulse width  300 μs, duty cycle  2 %.
c.
When mounted on 1" square PCB (FR4 material).
d.
Parametric verification ongoing.
e.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK 1212-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
f.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S12-1...


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