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SIR846DP

Vishay
Part Number SIR846DP
Manufacturer Vishay
Description N-Channel 100-V (D-S) MOSFET
Published Feb 10, 2016
Detailed Description New Product N-Channel 100-V (D-S) MOSFET SiR846DP Vishay Siliconix PRODUCT SUMMARY VDS (V) 100 RDS(on) (Ω) 0.0078 at...
Datasheet PDF File SIR846DP PDF File

SIR846DP
SIR846DP

Overview
New Product N-Channel 100-V (D-S) MOSFET SiR846DP Vishay Siliconix PRODUCT SUMMARY VDS (V) 100 RDS(on) (Ω) 0.
0078 at VGS = 10 V 0.
0085 at VGS = 7.
5 V ID (A)a 60 60 Qg (Typ.
) 35.
7 nC PowerPAK® SO-8 6.
15 mm D 8D 7 D 6 D 5 S 1S 5.
15 mm 2 S 3G 4 FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • 100 % Rg Tested • 100 % UIS Tested • Compliant to RoHS Directive 2002/95/EC APPLICATIONS • Primary Side Switch • Isolated DC/DC Converters • Full Bridge D G Bottom View Ordering Information: SiR846DP-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Drain-Source Voltage Gate-Source Voltage VDS VGS Continuous Drain Current (TJ = 150 °C) TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C ID Pulsed Drain Current Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IDM IS Single Pulse Avalanche Current Single Pulse Avalanche Energy L = 0.
1 mH IAS EAS TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C PD Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e TA = 70 °C TJ, Tstg Limit 100 ± 20 60a 60a 20b, c 16b, c 100 60a 5.
6b, c 35 61 104 66.
6 6.
25b, c 4.
0b, c - 55 to 150 260 Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t ≤ 10 s Steady State RthJA RthJC 15 0.
9 20 °C/W 1.
2 Notes: a.
Package limited.
b.
Surface Mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
See Solder Profile (www.
vishay.
com/ppg?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework Conditions: manual soldering with a soldering ir...


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