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SIR836DP

Part Number	SIR836DP
Manufacturer	Vishay
Description	N-Channel MOSFET
Published	Feb 11, 2016
Detailed Description	New Product N-Channel 40-V (D-S) MOSFET SiR836DP Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.019 at VGS ...
Datasheet	SIR836DP PDF File

Overview

New Product N-Channel 40-V (D-S) MOSFET SiR836DP Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.
019 at VGS = 10 V 40 0.
0225 at VGS = 4.
5 V PowerPAK SO-8 ID (A)a, e 21 19.
6 Qg (Typ.
) 5.
8 nC FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • 100 % Rg and UIS Tested • Compliant to RoHS Directive 2002/95/EC 6.
15 mm D 8D 7 D 6 D 5 S 1S 5.
15 mm 2 S 3G 4 Bottom View APPLICATIONS • POL • Synchronous Rectification D G S Ordering Information: SiR836DP-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage TC = 25 °C VGS Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C TA = 70 °C ID Pulsed Drain Current IDM Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IS Single Pulse Avalanche Current Avalanche Energy L = 0.
1 mH IAS EAS TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C PD TA = 70 °C Operating Junction and Storage Temperature Range TJ, Tstg Soldering Recommendations (Peak Temperature)f, g Limit 40 ± 20 21 17 10.
6b, c 8.
5b, c 50 14 3.
5b, c 10 5 15.
6 10 3.
9b, c 2.
5b, c - 55 to 150 260 Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, d Maximum Junction-to-Case (Drain) t ≤ 10 s Steady State RthJA RthJC 27 6.
4 32 °C/W 8.
0 Notes: a.
Based on TC = 25 °C.
b.
Surface Mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
Maximum under Steady State conditions is 70 °C/W.
e.
Package limited.
f.
See Solder Profile (www.
vishay.
com/ppg?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
g.
Rework Conditions: manual sol...

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