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SIR172ADP

Part Number	SIR172ADP
Manufacturer	Vishay
Description	N-Channel MOSFET
Published	Feb 12, 2016
Detailed Description	N-Channel 30 V (D-S) MOSFET SiR172ADP Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) () Max. 30 0.0085 at VGS = ...
Datasheet	SIR172ADP PDF File

Overview

N-Channel 30 V (D-S) MOSFET SiR172ADP Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) () Max.
30 0.
0085 at VGS = 10 V 0.
0105 at VGS = 4.
5 V ID (A)a, g 24 24 Qg (Typ.
) 12.
8 nC PowerPAK SO-8 FEATURES • TrenchFET® Power MOSFET • Low Thermal Resistance PowerPAK® Package with Low 1.
07 mm Profile • Optimized for High-Side Synchronous Rectifier Operation • 100 % Rg and UIS Tested • Material categorization: For definitions of compliance please see www.
vishay.
com/doc?99912 6.
15 mm S 1S 5.
15 mm 2 S 3G 4 D 8D 7 D 6 D 5 Bottom View Ordering Information: SiR172ADP-T1-GE3 (Lead (Pb)-free and Halogen-free) APPLICATIONS • Notebook CPU Core - High-Side Switch ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C ID TA = 70 °C Pulsed Drain Current (t = 300 µs) IDM Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IS Single Pulse Avalanche Current Avalanche Energy L = 0.
1 mH IAS EAS TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C PD TA = 70 °C Operating Junction and Storage Temperature Range TJ, Tstg Soldering Recommendations (Peak Temperature)d, e Limit 30 ± 20 24g 24g 16.
1b, c 12.
9b, c 60 24g 3.
5b, c 10 5 29.
8 19 3.
9b, c 2.
5b, c - 55 to 150 260 D G S N-Channel MOSFET Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t  10 s Steady State RthJA RthJC 27 3.
5 32 °C/W 4.
2 Notes: a.
Base on TC = 25 °C.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
See Solder Profile (www.
vishay.
com/doc?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom s...

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SIR172ADP N-Channel MOSFET - Vishay

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