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SIR862DP

Part Number	SIR862DP
Manufacturer	Vishay
Description	N-Channel MOSFET
Published	Feb 12, 2016
Detailed Description	New Product N-Channel 25-V (D-S) MOSFET SiR862DP Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.0028 at VGS...
Datasheet	SIR862DP PDF File

Overview

New Product N-Channel 25-V (D-S) MOSFET SiR862DP Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.
0028 at VGS = 10 V 25 0.
0035 at VGS = 4.
5 V ID (A)a, e 50 50 Qg (Typ.
) 28.
4 nC FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • 100 % Rg and UIS Tested • Compliant to RoHS Directive 2002/95/EC PowerPAK® SO-8 6.
15 mm D 8D 7 D 6 D 5 S 1S 5.
15 mm 2 S 3G 4 Bottom View Ordering Information: SiR862DP-T1-GE3 (Lead (Pb)-free and Halogen-free) APPLICATIONS • DC/DC Conversion - Low-Side Switch • Notebook • Server • Game Console D G S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Drain-Source Voltage Gate-Source Voltage VDS VGS TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C ID TA = 70 °C Pulsed Drain Current Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IDM IS Single Pulse Avalanche Current Avalanche Energy L = 0.
1 mH IAS EAS TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C PD TA = 70 °C Operating Junction and Storage Temperature Range TJ, Tstg Soldering Recommendations (Peak Temperature)f, g Limit 25 ± 20 50e 50e 32b, c 22.
8b, c 70 50e 4.
7b, c 40 80 69 44.
4 5.
2b, c 3.
3b, c - 55 to 150 260 Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, d Maximum Junction-to-Case (Drain) t ≤ 10 s Steady State RthJA RthJC 19 1.
2 24 °C/W 1.
8 Notes: a.
Based on TC = 25 °C.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
Maximum under steady state conditions is 65 °C/W.
e.
Package limited.
f.
See solder profile (www.
vishay.
com/ppg?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
g.
...

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