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SIS332DN

Part Number	SIS332DN
Manufacturer	Vishay
Description	N-Channel MOSFET
Published	Feb 12, 2016
Detailed Description	New Product N-Channel 30 V (D-S) MOSFET SiS332DN Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) () 30 0.0084 at ...
Datasheet	SIS332DN PDF File

Overview

New Product N-Channel 30 V (D-S) MOSFET SiS332DN Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) () 30 0.
0084 at VGS = 10 V 0.
0110 at VGS = 4.
5 V ID (A)f 35g 35g Qg (Typ.
) 8.
1 nC PowerPAK 1212-8 FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • PWM Optimized • 100 % Rg Tested • 100 % UIS Tested • Compliant to RoHS Directive 2002/95/EC 3.
30 mm D 8D 7 D 6 D 5 S 1S 3.
30 mm 2 S 3G 4 Bottom View APPLICATIONS • High Side Switch - POL - Notebook PC - Server G D S Ordering Information: SiS332DN-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current (t = 300 µs) TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Continuous Source-Drain Diode Current Single Pulse Avalanche Current Single Pulse Avalanche Energy TC = 25 °C TA = 25 °C L = 0.
1 mH TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)c, d VDS VGS ID IDM IS IAS EAS PD TJ, Tstg Limit 30 ± 20 35g 35g 15.
4a, b 12.
3a, b 50 35g 3.
2a, b 20 20 33 21 3.
6a, b 2.
3a, b - 55 to 150 260 Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambienta, e Maximum Junction-to-Case (Drain) t  10 s Steady State Symbol RthJA RthJC Typical 28 2.
9 Maximum 35 3.
8 Unit °C/W Notes: a.
Surface mounted on 1" x 1" FR4 board.
b.
t = 10 s.
c.
See solder profile (www.
vishay.
com/ppg?73257).
The PowerPAK 1212-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
d.
Rework conditions: manual soldering with a soldering iron is not recommend...

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