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SIS626DN

Vishay
Part Number SIS626DN
Manufacturer Vishay
Description N-Channel MOSFET
Published Feb 12, 2016
Detailed Description www.vishay.com SiS626DN Vishay Siliconix N-Channel 25 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 25 RDS(on) (Ω) (Max.) ...
Datasheet PDF File SIS626DN PDF File

SIS626DN
SIS626DN

Overview
www.
vishay.
com SiS626DN Vishay Siliconix N-Channel 25 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 25 RDS(on) (Ω) (Max.
) 0.
0090 at VGS = 10 V 0.
0096 at VGS = 4.
5 V 0.
0115 at VGS = 2.
5 V ID (A) f 16 g 16 g 16 g Qg (Typ.
) 18.
2 nC PowerPAK® 1212-8 Single D D8 D7 D6 5 3.
3 mm 1 Top View 3.
3 mm 1 2S 3S 4S G Bottom View Ordering Information: SiS626DN-T1-GE3 (lead (Pb)-free and halogen-free) FEATURES • TrenchFET® power MOSFET • 100% Rg and UIS tested • Material categorization: for definitions of compliance please see www.
vishay.
com/doc?99912 APPLICATIONS • Adaptor switch • Load switch • Synchronous buck - High-side G D S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-Source Voltage Gate-Source Voltage TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current (t = 100 μs) Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C Single Pulse Avalanche Current Single Pulse Avalanche Energy L = 0.
1 mH TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) c, d VDS VGS ID IDM IS IAS EAS PD TJ, Tstg LIMIT 25 ± 12 16 g 16 g 15.
1 a, b 11.
7 a, b 32 16 g 3.
1 a, b 20 20 52 33 3.
7 a, b 2.
4 a, b -55 to +150 260 UNIT V A mJ W °C THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT Maximum Junction-to-Ambient a, e Maximum Junction-to-Case (Drain) t ≤ 10 s Steady State RthJA RthJC 28 2 34 °C/W 2.
4 Notes a.
Surface mounted on 1" x 1" FR4 board.
b.
t = 10 s.
c.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK 1212-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
d.
Rework conditions: man...


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