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SQJ912AEP

Vishay
Part Number SQJ912AEP
Manufacturer Vishay
Description Automotive Dual N-Channel MOSFET
Published Mar 3, 2016
Detailed Description www.vishay.com SQJ912AEP Vishay Siliconix Automotive Dual N-Channel 40 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) ...
Datasheet PDF File SQJ912AEP PDF File

SQJ912AEP
SQJ912AEP

Overview
www.
vishay.
com SQJ912AEP Vishay Siliconix Automotive Dual N-Channel 40 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on) () at VGS = 10 V RDS(on) () at VGS = 4.
5 V ID (A) per leg Configuration PowerPAK® SO-8L Dual 40 0.
0093 0.
0111 30 Dual 6.
15 mm D 2 4 G2 3 S2 2 G1 1 S1 Bottom View D 1 5.
13 mm FEATURES • TrenchFET® Power MOSFET • 100 % Rg and UIS Tested • AEC-Q101 Qualifiedd • Material categorization:  For definitions of compliance please see www.
vishay.
com/doc?99912 D1 D2 G1 G2 S1 N-Channel MOSFET S2 N-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free PowerPAK SO-8L SQJ912AEP-T1-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-Source Voltage VDS Gate-Source Voltage VGS Continuous Drain Currenta Continuous Source Current (Diode Conduction)a Pulsed Drain Currentb TC = 25 °C TC = 125 °C ID IS IDM Single Pulse Avalanche Current Single Pulse Avalanche Energy L = 0.
1 mH IAS EAS Maximum Power Dissipationb TC = 25 °C TC = 125 °C PD Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)e, f TJ, Tstg LIMIT 40 ± 20 30 29 30 120 26 34 48 16 - 55 to + 175 260 UNIT V A mJ W °C THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT Junction-to-Ambient Junction-to-Case (Drain) PCB Mountc RthJA 85 °C/W RthJC 3.
1 Notes a.
Package limited.
b.
Pulse test; pulse width  300 μs, duty cycle  2 %.
c.
When mounted on 1" square PCB (FR4 material).
d.
Parametric verification ongoing.
e.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK SO-8L is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
f.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components...


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