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SQJ850EP

Vishay
Part Number SQJ850EP
Manufacturer Vishay
Description Automotive N-Channel MOSFET
Published Mar 3, 2016
Detailed Description www.vishay.com SQJ850EP Vishay Siliconix Automotive N-Channel 60 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on...
Datasheet PDF File SQJ850EP PDF File

SQJ850EP
SQJ850EP

Overview
www.
vishay.
com SQJ850EP Vishay Siliconix Automotive N-Channel 60 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on) (Ω) at VGS = 10 V RDS(on) (Ω) at VGS = 4.
5 V ID (A) Configuration PowerPAK® SO-8L Single 60 0.
023 0.
032 24 Single D FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • AEC-Q101 Qualifiedd • 100 % Rg and UIS Tested • Compliant to RoHS Directive 2002/95/EC 6.
15 mm 4 G 3 S 2 S 1 S D 5.
13 mm G S N-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free PowerPAK SO-8L SQJ850EP-T1-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-Source Voltage VDS Gate-Source Voltage VGS Continuous Drain Currenta Continuous Source Current (Diode Conduction)a Pulsed Drain Currentb TC = 25 °C TC = 125 °C ID IS IDM Single Pulse Avalanche Current Single Pulse Avalanche Energy L = 0.
1 mH IAS EAS Maximum Power Dissipationb TC = 25 °C TC = 125 °C PD Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)e, f TJ, Tstg LIMIT 60 ± 20 24 17 24 96 15 11 45 15 - 55 to + 175 260 UNIT V A mJ W °C THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT Junction-to-Ambient Junction-to-Case (Drain) PCB Mountc RthJA 70 °C/W RthJC 3.
3 Notes a.
Package limited.
b.
Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
c.
When mounted on 1" square PCB (FR-4 material).
d.
Parametric verification ongoing.
e.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK SO-8L.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
f.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S11-2419-Rev.
F, 19-Dec-11 1 Document Number: 65280 THIS DOCUMENT IS SUBJECT TO CHANGE WITHO...


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