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BSP52T1G

ON Semiconductor
Part Number BSP52T1G
Manufacturer ON Semiconductor
Description NPN Small-Signal Darlington Transistor
Published Apr 1, 2016
Detailed Description BSP52T1G, BSP52T3G NPN Small-Signal Darlington Transistor This NPN small signal Darlington transistor is designed for u...
Datasheet PDF File BSP52T1G PDF File

BSP52T1G
BSP52T1G

Overview
BSP52T1G, BSP52T3G NPN Small-Signal Darlington Transistor This NPN small signal Darlington transistor is designed for use in switching applications, such as print hammer, relay, solenoid and lamp drivers.
The device is housed in the SOT-223 package, which is designed for medium power surface mount applications.
Features • The SOT-223 Package can be soldered using wave or reflow.
The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die • Available in 12 mm Tape and Reel Use BSP52T1 to Order the 7 Inch/1000 Unit Reel • PNP Complement is BSP62T1 • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Max Unit Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current Total Power Dissipation (Note 1) @ TA = 25°C Derate above 25°C VCES VCBO VEBO IC PD 80 V 90 V 5.
0 V 1.
0 A 0.
8 W 6.
4 mW/°C Total Power Dissipation (Note 2) @ TA = 25°C Derate above 25°C PD 1.
25 W 10 mW/°C Operating and Storage Temperature Range TJ, Tstg −65 to 150 °C THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance (Note 1) Junction-to-Ambient RqJA 156 °C/W Thermal Resistance (Note 2) Junction-to-Ambient RqJA 100 °C/W Maximum Temperature for Soldering Purposes Time in Solder Bath TL 260 °C 10 Sec Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.
2.
Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm2 pad.
http://onsemi.
com MEDIUM POWER NPN SILICON SURFACE MOUNT DARLINGTON TRANSISTOR COLLECTOR 2,4 BASE 1 EMITTER 3 4 MARKING DIAGRAM 123 SOT−223 CAS...


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