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S-LNTK3043PT5G

LRC
Part Number S-LNTK3043PT5G
Manufacturer LRC
Description Power MOSFET
Published May 1, 2016
Detailed Description LESHAN RADIO COMPANY, LTD. Power MOSFET 20 V, 285 mA, P−Channel with ESD Protection, SOT−723 Features • Enables High ...
Datasheet PDF File S-LNTK3043PT5G PDF File

S-LNTK3043PT5G
S-LNTK3043PT5G

Overview
LESHAN RADIO COMPANY, LTD.
Power MOSFET 20 V, 285 mA, P−Channel with ESD Protection, SOT−723 Features • Enables High Density PCB Manufacturing • 44% Smaller Footprint than SC−89 and 38% Thinner than SC−89 • Low Voltage Drive Makes this Device Ideal for Portable Equipment • Low Threshold Levels, VGS(TH) < 1.
3 V • Low Profile (< 0.
5 mm) Allows It to Fit Easily into Extremely Thin Environments such as Portable Electronics • Operated at Standard Logic Level Gate Drive, Facilitating Future Migration to Lower Levels Using the Same Basic Topology • These are Pb−Free Devices • S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.
Applications • Interfacing, Switching • High Speed Switching • Cellular Phones, PDAs MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Parameter Symbol Value Unit Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain Current (Note 1) Power Dissipation (Note 1) Steady State tv5s Steady State tv5s TA = 25°C TA = 85°C TA = 25°C TA = 25°C VDSS VGS ID PD 20 V ±10 V 255 185 mA 285 440 mW 545 Continuous Drain Current (Note 2) Power Dissipation (Note 2) Steady State TA = 25°C TA = 85°C TA = 25°C ID PD 210 mA 155 310 mW Pulsed Drain Current tp = 10 ms IDM Operating Junction and Storage Temperature TJ, TSTG 400 −55 to 150 mA °C Source Current (Body Diode) (Note 2) IS 286 mA Lead Temperature for Soldering Purposes (1/8” from case for 10 seconds) TL 260 °C Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.
127 in sq [1 oz] including traces) 2.
Surface−mounted on FR4 board using the minimum recommended pad size.
LNTK3043PT5G S-LNTK3043PT5G...


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