• Low profile package • Ideal for automated placement • Glass passivated pellet chip junction • Low forward voltage drop • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C • Material ca...
CS2M PDF File
CS2N80A3HY
CS2N70FA9
CS2N70A6
CS2N70A4
CS2N70A3R1-G