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BYG70

Part Number	BYG70
Manufacturer	NXP
Description	Fast soft-recovery controlled avalanche rectifiers
Published	Mar 23, 2005
Detailed Description	DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D168 BYG70 series Fast soft-recovery controlled avalanche rectifiers...
Datasheet	BYG70 PDF File

Overview

DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D168 BYG70 series Fast soft-recovery controlled avalanche rectifiers Preliminary speciﬁcation 1996 Jun 05 Philips Semiconductors Preliminary speciﬁcation Fast soft-recovery controlled avalanche rectiﬁers FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape.
Top view Side view handbook, 4 columns BYG70 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
DESCRIPTION DO-214AC surface mountable package with glass passivated chip...

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