Power transistor. BUX84S Datasheet

BUX84S transistor. Datasheet pdf. Equivalent


NXP BUX84S
Philips Semiconductors
NPN high voltage
Power transistor
Product specification
BUX84S
FEATURES
• Fast switching
• Excellent thermal stability
• High thermal cycling performance
• Low thermal resistance
• Surface mounting package
SYMBOL
b
c
e
GENERAL DESCRIPTION
High voltage, high speed glass
passivated NPN power transistor in
a plastic package.
Applications:-
Off-line SMPS
TV and monitor power supplies
Inverters
Electronic lighting ballasts
The BUX84S is supplied in the
SOT428 (DPAK) surface mounting
package.
PINNING
PIN
DESCRIPTION
1 base
2 collector1
3 emitter
4 collector (tab)
QUICK REFERENCE DATA
VCESM = 800 V
VCEO = 400 V
IC = 2 A
VCE(SAT) 1 V (IC = 1 A)
tf = 0.4 µs (typ)
SOT428
tab
2
13
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
VCESM
VCEO
VEBO
IC
ICM
IB
IBM
-IBM
Ptot
Tj, Tstg
Collector-emitter voltage
(peak value)
Collector-emitter voltage
(DC)
Emitter-base voltage
Collector current (DC)
Collector current (peak
value)
Base current (DC)
Base current (peak value)
Reverse base current (peak
value during turn-off)
Total power dissipation
Operating junction and
storage temperature
VBE = 0 V
base open circuit
collector open circuit
tp = 2 ms
Tmb = 25 ˚C
MIN.
-
-
-
-
-
-
-
-
-
- 65
MAX.
800
400
5
2
3
0.75
1
1
50
150
UNIT
V
V
V
A
A
A
A
A
W
˚C
1 It is not possible to make connection to pin:2 of the SOT428 package.
February 1999
1
Rev 1.000


BUX84S Datasheet
Recommendation BUX84S Datasheet
Part BUX84S
Description NPN high voltage Power transistor
Feature BUX84S; Philips Semiconductors Product specification NPN high voltage Power transistor FEATURES • Fast swi.
Manufacture NXP
Datasheet
Download BUX84S Datasheet




NXP BUX84S
Philips Semiconductors
NPN high voltage
Power transistor
Product specification
BUX84S
THERMAL RESISTANCES
SYMBOL PARAMETER
Rth j-mb
Rth j-a
Thermal resistance junction
to mounting base
Thermal resistance junction
to ambient
CONDITIONS
pcb mounted, FR4 board, minimum
footprint
MIN. TYP. MAX. UNIT
- - 2.5 K/W
- 50 - K/W
ELECTRICAL CHARACTERISTICS
Tj= 25˚C unless otherwise specified
For characteristic curves, refer to BUX84 data sheet.
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VCEO(sust
VCE(SAT)
VBE(SAT)
ICES
IEBO
hFE
Collector-emitter sustaining
voltage
Collector-emitter saturation
voltage
Base-emitter saturation
voltage
Collector-emitter cut-off
current
Emitter-base cut-off current
DC current gain
IC = 100 mA; IB(OFF) = 0 A; L = 25 mH
IC = 0.3 A; IB = 30 mA
IC = 1 A; IB = 0.2 A
IC = 1 A; IB = 0.2 A
VCEM = 800 V; VBE = 0 V
VCEM = 800 V; VBE = 0 V; Tj = 125˚C
VEB = 5 V; IC = 0 A
VCE = 5 V; IC = 5 mA
VCE = 5 V; IC = 100 mA
400 -
-V
- - 0.8 V
- - 1V
- - 1.1 V
- - 200 µA
- - 1.5 mA
- - 1 mA
15 -
-
20 50 100
fT Transition frequency
VCE = 10 V; IC = 200 mA; f = 1 MHz
- 20 - MHz
ton Turn-on time
tf Fall time
ts Storage time
IC(on) = 1 A; IB(on) = 200 mA; IB(off) = -400 mA;
VCC = 250 V
Tj = 25˚C
Tj = 95˚C
-
-
-
-
0.2 0.5 µs
0.4 - µs
- 1.4 µs
2 3.5 µs
February 1999
2
Rev 1.000



NXP BUX84S
Philips Semiconductors
NPN high voltage
Power transistor
MECHANICAL DATA
Plastic surface mounted package (Philips version of D-PAK); 2 leads
Product specification
BUX84S
SOT428
seating plane
y
A
EA
A2
b2 A1
D
HE
L2
1
b1
e
e1
L
2
b wM A
L1
c
E1
D1
0 10 20 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT max.
A1(1)
A2
b
b1
max.
b2
c
mm 2.38 0.65 0.89 0.89 1.1 5.36 0.4
2.22 0.45 0.71 0.71 0.9 5.26 0.2
D D1 E E1
max. max. max. min.
e
e1
HE
max.
L
6.22 4.81 6.73
5.98 4.45 6.47
4.0
2.285 4.57
10.4
9.6
2.95
2.55
L1
min.
0.5
L2
0.7
0.5
Note
1. Measured from heatsink back to lead.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
w
y
max.
0.2 0.2
ISSUE DATE
SOT428
97-06-11
Fig.1. SOT428 surface mounting package. Centre pin connected to mounting base.
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static
discharge during transport or handling.
2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.
3. Epoxy meets UL94 V0 at 1/8".
February 1999
3
Rev 1.000





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