TMP61 Thermistor Datasheet

TMP61 Datasheet PDF, Equivalent


Part Number

TMP61

Description

Small Silicon-Based Linear Thermistor

Manufacture

etcTI

Total Page 30 Pages
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TMP61
SBOS921C – DECEMBER 2018 – REVISED SEPTEMBER 2019
TMP61 Small Silicon-Based Linear Thermistor for Temperature Sensing
1 Features
1 Silicon-based thermistor with a
Positive Temperature Coefficient (PTC)
• Linear resistance change with temperature
– Simplifies resistance-to-temperature
conversion
– Decrease accuracy spread compared to non-
linear Negative Temperature Coefficient (NTC)
thermistor-based circuits across a wide
temperature range
• 10-knominal resistance at 25°C (R25)
– ±1% maximum (0°C to 70°C)
• Consistent sensitivity across temperature
– 6400 ppm/°C TCR (25°C)
– 0.2% typical TCR tolerance across
temperature (–40°C to 125°C)
• Wide operating temperature:
– –65°C to +150°C
• Fast thermal response time:
– 0.6 second for DEC package
• Long lifetime and robust performance
– Ultra low power consumption compared to
traditional NTCs that lower errors due to self
heating
– Built-in fail-safe in case of short-circuit failures
– <1% maximum drift after high temperature and
high humidity stress tests
• Available package options:
– X1SON (DEC/0402 footprint)
– TO-92S (LPG)
– SOT-5X3 (DYA) (contact representative for
availability)
2 Applications
• Temperature Measurement and Monitoring
• Thermal Compensation
• Thermal Protection (With Comparator)
3 Description
The TMP61 series of small silicon linear thermistors
are designed for temperature measurement,
protection, compensation, and control systems.
Compared to traditional NTC thermistors, the TMP61
device offers enhanced linearity and consistent
sensitivity across the full temperature range. The
TMP61 offers robust performance due to device
immunity to environmental variation and built-in fail-
safe behaviors at high temperatures. This device is
currently available in a 2-pin, surface-mount, 0402
footprint-compatible X1SON package and a 2-pin,
through-hole, mini-sized transistor-outline TO-92S
package, and a low profile 2-pin SOT-5X3 package.
PART NUMBER
TMP61
Device Information(1)
PACKAGE
BODY SIZE (NOM)
X1SON (2)
0.60 mm × 1.00 mm
TO-92S (2)
SOT-5X3 (2)(2)
4.00 mm × 3.15 mm
0.80 mm × 1.20 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) This package is in preview
SPACER
SPACER
SPACER
SPACER
Typical Implementation Circuits
VBias
RBias
IBias
RTMP61
+
VTEMP
-
RTMP61
+
VTEMP
-
Typical Resistances vs Ambient Temperature
25
20
15
10
VTemp = VBias X RTMP61
RBias + RTMP61
VTemp = IBias X RTMP61
5
-40 -20 0
20 40 60 80 100 120 140 160
Temperature (qC)
d001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.

TMP61
TMP61
SBOS921C – DECEMBER 2018 – REVISED SEPTEMBER 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Typical Characteristics .............................................. 6
8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes........................................ 14
9 Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application .................................................. 15
10 Power Supply Recommendations ..................... 21
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 22
12 Device and Documentation Support ................. 23
12.1 Receiving Notification of Documentation Updates 23
12.2 Support Resources ............................................... 23
12.3 Trademarks ........................................................... 23
12.4 Electrostatic Discharge Caution ............................ 23
12.5 Glossary ................................................................ 23
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (July 2019) to Revision C
Page
• Added preview SOT-5X3 package ........................................................................................................................................ 1
Changes from Revision A (June 2019) to Revision B
Page
• Changed Application bullets .................................................................................................................................................. 1
• Increased ESD CDM Rating................................................................................................................................................... 4
• Added Thermal Information for LPG Package ....................................................................................................................... 4
• Added 'Long Term Drift' spec for LPG package ..................................................................................................................... 5
• Changed polynomial equation ................................................................................................................................................ 8
• Added equations for both DEC package and LPG packages ................................................................................................ 8
• Added transfer tables for the LPG package .......................................................................................................................... 9
• Changed Layout Example section ....................................................................................................................................... 22
Changes from Original (December 2018) to Revision A
Page
• Changed data sheet status from Production Mixed to Production Data ................................................................................ 1
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Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity TMP61 SBOS921C – DECEMBER 201 8 – REVISED SEPTEMBER 2019 TMP61 Smal l Silicon-Based Linear Thermistor for T emperature Sensing 1 Features •1 Sil icon-based thermistor with a Positive T emperature Coefficient (PTC) • Linear resistance change with temperature – Simplifies resistance-to-temperature c onversion – Decrease accuracy spread compared to nonlinear Negative Temperat ure Coefficient (NTC) thermistor-based circuits across a wide temperature rang e • 10-kΩ nominal resistance at 25 C (R25) – ±1% maximum (0°C to 70° C) • Consistent sensitivity across te mperature – 6400 ppm/°C TCR (25°C) – 0.2% typical TCR tolerance across t emperature (–40°C to 125°C) • Wid e operating temperature: – –65°C t o +150°C • Fast thermal response tim e: – 0.6 second for DEC package • L ong lifetime and robust performance – Ultra low power consumption compared to traditional NTCs that lower errors due to self heating – Built-in fail-s.
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