GaAs FET. TIM5964-60SL-422 Datasheet

TIM5964-60SL-422 FET. Datasheet pdf. Equivalent

Part TIM5964-60SL-422
Description MICROWAVE POWER GaAs FET
Feature MICROWAVE POWER GaAs FET TIM5964-60SL-422 FEATURES ŋBROAD BAND INTERNALLY MATCHED FET ŋHIGH POWER P1.
Manufacture Toshiba
Datasheet
Download TIM5964-60SL-422 Datasheet



TIM5964-60SL-422
MICROWAVE POWER GaAs FET
TIM5964-60SL-422
FEATURES
ŋBROAD BAND INTERNALLY MATCHED FET
ŋHIGH POWER
P1dB= 48.0dBm at 5.85GHz to 6.75GHz
ŋHIGH GAIN
G1dB= 8.0dB at 5.85GHz to 6.75GHz
ŋLOW INTERMODULATION DISTORTION
IM3= -45dBc at Pout= 36.5dBm (Single Carrier Level)
ŋHERMETICALLY SEALED PACKAGE
RF PERFORMANCE SPECIFICATIONS ( Ta= 25°C )
CHARACTERISTICS
Output Power at 1dB
Gain Compression Point
Power Gain at 1dB
Gain Compression Point
Drain Current
Gain Flatness
SYMBOL
CONDITIONS
P1dB
G1dB
IDS1
G
VDS= 10V
IDSset= 9.5A
f= 5.85 to 6.75GHz
Power Added Efficiency
3rd Order Intermodulation
Distortion
Drain Current
Channel Temperature Rise
add
IM3
IDS2
Tch
Two-Tone Test
Po= 36.5dBm, f= 5MHz
(Single Carrier Level)
(VDS IDS Pin P1dB)
Rth(c-c)
Recommended Gate Resistance(Rg): 28
UNIT
dBm
dB
A
dB
%
dBc
A
°C
MIN. TYP. MAX.
47.0 48.0
7.0
8.0
13.2 15.0
0.8
40
-40 -45
11.8
100
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )
CHARACTERISTICS
Transconductance
Pinch-off Voltage
Saturated Drain Current
Gate-Source Breakdown Voltage
SYMBOL
gm
VGSoff
IDSS
CONDITIONS
VDS= 3V
IDS= 12.0A
VDS= 3V
IDS= 200mA
VDS= 3V
VGS= 0V
VGSO IGS= -1.0mA
Thermal Resistance
Rth(c-c) Channel to Case
UNIT MIN. TYP. MAX.
S
20
V
-1.0 -1.8 -3.0
A
38
V
-5
°C/W
0.6
0.8
The information contained herein is presented as guidance for product use. No responsibility is assumed by
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION (hereinafter, referred to as “TISS”) for
any infringement of patents or any other intellectual property rights of third parties that may result from the use of
product. No license to any intellectual property right is granted by this document. The information contained herein
is subject to change without prior notice. It is advisable to contact TISS before proceeding with design of equipment
incorporating this product.
Copyright © 2019 TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION, All Rights Reserved. 2_20190220_No1079 Page: 1 / 7



TIM5964-60SL-422
ABSOLUTE MAXIMUM RATINGS ( Ta= 25°C )
MICROWAVE POWER GaAs FET
TIM5964-60SL-422
CHARACTERISTICS
SYMBOL
UNIT
RATING
Drain-Source Voltage
Gate-Source Voltage
VDS
V
15
VGS
V
-5
Drain Current
Total Power Dissipation (Tc= 25°C)
Channel Temperature
Storage Temperature
IDS
A
20
PT
W
187.5
Tch
°C
175
Tstg
°C
-65 to +175
PACKAGE OUTLINE ( 2-16G1B )
Unit in mm
Gate
Source
Drain
HANDLING PRECAUTIONS FOR PACKAGE MODEL
Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260°C or 3 seconds at
350°C.
Copyright © 2019 TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION, All Rights Reserved. 2_20190220_No1079 Page: 2 / 7





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)