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MA4BPS301

Part Number	MA4BPS301
Manufacturer	Tyco
Description	PIN Diode Chips with Offset Bond Pads
Published	Apr 27, 2005
Detailed Description	PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips...
Datasheet	MA4BPS301 PDF File

Overview

PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond Pads Features • • • • • Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout Description These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.
They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges.
The large pads allow use of multiple bond wires.
The location of these pads on a glass substrate results ...

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MA4BPS301 PIN Diode Chips with Offset Bond Pads - Tyco

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