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SIGC04T60G Datasheet, Equivalent, IGBT.

IGBT

IGBT

 

 

 

Part SIGC04T60G
Description IGBT
Feature www.
DataSheet4U.
com SIGC04T60G IGBT Chi p FEATURES:
• 600V Trench & Field Sto p technology
• low VCE(sat)
• low t urn-off losses
• short tail current positive temperature coefficient
• easy paralleling 3 This chip is used for:
• power module
• discrete comp onents Applications:
• drives
• whi te goods
• resonant applications C G E Chip Type SIGC04T60G VCE 600V I Cn 6A Die Size 1.
89 x 2.
17 mm2 Packag e sawn on foil Ordering Code Q67050A43 46-A101 MECHANICAL PARAMETER: Raster s ize Emitter pad size Gate pad size Area total / active Thickness Wafer size Fl at position Max.
possible chips per .
Manufacture Infineon Technologies
Datasheet
Download SIGC04T60G Datasheet
Part SIGC04T60G
Description IGBT
Feature www.
DataSheet4U.
com SIGC04T60G IGBT Chi p FEATURES:
• 600V Trench & Field Sto p technology
• low VCE(sat)
• low t urn-off losses
• short tail current positive temperature coefficient
• easy paralleling 3 This chip is used for:
• power module
• discrete comp onents Applications:
• drives
• whi te goods
• resonant applications C G E Chip Type SIGC04T60G VCE 600V I Cn 6A Die Size 1.
89 x 2.
17 mm2 Packag e sawn on foil Ordering Code Q67050A43 46-A101 MECHANICAL PARAMETER: Raster s ize Emitter pad size Gate pad size Area total / active Thickness Wafer size Fl at position Max.
possible chips per .
Manufacture Infineon Technologies
Datasheet
Download SIGC04T60G Datasheet

SIGC04T60G

SIGC04T60G
SIGC04T60G

SIGC04T60G

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