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Solder Mask. PSR-4000BN Datasheet

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Solder Mask. PSR-4000BN Datasheet






PSR-4000BN Mask. Datasheet pdf. Equivalent




PSR-4000BN Mask. Datasheet pdf. Equivalent





Part

PSR-4000BN

Description

Liquid Photoimageable Solder Mask

Manufacture

Taiyo

Datasheet
Download PSR-4000BN Datasheet


Taiyo PSR-4000BN

PSR-4000BN; www.DataSheet4U.com TAIYO PSR-4000BN Se ries LIQUID PHOTOIMAGEABLE SOLDER MASK Screen or Spray Application Available i n Green or Dark Green Semi-Gloss Finish RoHS Compliant High Viscosity version for improved edge coverage on High Trac es Compatible with Lead-Free Processing Best In Class for Small Hole Clearing Wide Processing Window Fine Dam Resolut ion Withstands ENI.


Taiyo PSR-4000BN

G & Immersion Tin Revised March 2005 Pa ge 2 of 6 www.DataSheet4U.com PROCESSI NG PARAMETERS FOR PSR-4000BN SERIES PSR -4000BN Series includes PSR-4000BN, PSR -4000BN (HV), and PSR-4000BN (DG). They are two-component, alkaline developabl e LPI solder mask products for flood sc reen and spray application methods. The products are designed to be user frien dly with wide proc.


Taiyo PSR-4000BN

essing latitudes, low odor, fast develop ing and good resistance to alternate me tal finishes such as ENIG and immersion Tin while maintaining dams of 3 mils o r less. The PSR-4000 BN (HV) provides i mproved edge coverage over high circuit s while the PSR4000BN (DG) provides the same benefit in a Dark Green color. PS R-4000BN Series meets or exceeds the re quirements of IPC .



Part

PSR-4000BN

Description

Liquid Photoimageable Solder Mask

Manufacture

Taiyo

Datasheet
Download PSR-4000BN Datasheet




 PSR-4000BN
www.DataSheet4U.com
TAIYO PSR-4000BN Series
LIQUID PHOTOIMAGEABLE SOLDER MASK
Screen or Spray Application
Available in Green or Dark Green
Semi-Gloss Finish
RoHS Compliant
High Viscosity version for improved
edge coverage on High Traces
Compatible with Lead-Free Processing
Best In Class for Small Hole Clearing
Wide Processing Window
Fine Dam Resolution
Withstands ENIG & Immersion Tin
Revised March 2005





 PSR-4000BN
Page 2 of 6
www.DataSheet4U.com
PROCESSING PARAMETERS FOR PSR-4000BN SERIES
PSR-4000BN Series includes PSR-4000BN, PSR-4000BN (HV), and PSR-4000BN (DG).
They are two-component, alkaline developable LPI solder mask products for flood screen
and spray application methods. The products are designed to be user friendly with wide
processing latitudes, low odor, fast developing and good resistance to alternate metal
finishes such as ENIG and immersion Tin while maintaining dams of 3 mils or less. The
PSR-4000 BN (HV) provides improved edge coverage over high circuits while the PSR-
4000BN (DG) provides the same benefit in a Dark Green color. PSR-4000BN Series
meets or exceeds the requirements of IPC SM-840C Class H and Class T, Bellcore GR-
78-CORE Issue 1, and has a UL flammability rating of 94V-0. All Taiyo America products
comply with the Directive 2002/95/EC of the European Parliament and of the Council of 27
January 2003 on the Restriction of the use of certain Hazardous Substances (RoHS) in
electrical and electronic equipment.
PSR-4000BN SERIES COMPONENTS
PSR-4000BN Series/ CA-40BN
Mixing Ratio
100 parts
43 parts
Color
Green
White
Mixed Properties BN
HV
DG
Solids
77%
77%
77%
Viscosity
135-165ps 175-225ps 175-225ps
Specific Gravity
1.39 1.39
1.39
MIXING
PSR-4000BN Series is supplied in pre-measured containers with a
mix ratio by weight of 100 parts PSR-4000BN and 43 parts CA-
40BN. PSR-4000BN can be mixed by hand with a mixing spatula
for 10 – 15 minutes. Mixing can be done with a mechanical mixer
at low speeds to minimize shear thinning for 10 – 15 minutes. Also,
mixing can be done with a paint shaker for 10 – 15 minutes.
PRE-CLEANING
Prior to solder mask application, the printed circuit board surface
needs to be cleaned. Various cleaning methods include Pumice,
Aluminum Oxide, Mechanical Brush, and Chemical Clean. All of
these methods will provide a clean surface for the application of
PSR-4000BN Series. Hold time after cleaning the printed circuit
board should be held to a minimum to reduce the oxidation of the
copper surfaces.





 PSR-4000BN
Page 3 of 6
www.DataSheet4U.com
PROCESSING PARAMETERS FOR PSR-4000BN SERIES
SCREEN PRINTING
Method: Single Sided and Double Sided Screening
Screen Mesh: 74 – 110
Screen Mesh Angle: 22.5° Bias
Screen Tension: 20 - 28 Newtons
Squeegee: 60 – 80 durometer
Squeegee Angle: 27 – 35°
Printing Mode: Flood / Print / Print
Flood Pressure: 20 – 30 psi
Printing Speed: 2.0 – 9.9 inches/sec
Printing Pressure: 60 – 100 psi
TACK DRY CYCLE
The Tack Dry step is required to remove solvent from the solder
mask film and produce a firm dry surface. The optimum dwell time
and oven temperature will depend on oven type, oven loading, air
circulation, exhaust rate, and ramp times. Excessive tack dry times
and temperature will result in difficulty developing solder mask from
through holes and a reduction in photo speed. Insufficient tack dry
will result in artwork marking and/or sticking. Typical tack dry
conditions for PSR-4000BN Series are as followed:
Oven Temperature: 150 - 185°F (65 - 85°C)
For Single-Sided (Batch Oven)
1st Side:
Dwell Time: 10 - 20 minutes
2nd Side:
Dwell Time: 25 - 45 minutes
For Double-Sided (Conveyorized or Batch Oven)
Dwell Time: 25 - 60 minutes
EXPOSURE
PSR-4000BN Series requires UV exposure to define solder mask
dams and features. The spectral sensitivity of PSR-4000BN Series
is in the area of 365 nm. Exposure times will vary by bulb type and
age of the bulb. Below are guidelines for exposing PSR-4000BN
Series.
Exposure Unit: 5 kW or higher
Stouffer Step 21: Clear 8 minimum (on metal / under
phototool)
Energy: 250 mJ / cm2 minimum (under phototool)



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