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84-1LMISR4

Part Number	84-1LMISR4
Manufacturer	ETC
Description	ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
Published	Jul 11, 2007
Detailed Description	TECHNICAL DATASHEET ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 84-1LMISR4 electrically conductiv...
Datasheet	84-1LMISR4 PDF File

Overview

TECHNICAL DATASHEET ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment.
The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell ABLEBOND® 84-1LMISR4 times, without tailing or stringing problems.
The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
FEATURES • Excellent dispensability with minimal tailing and stringing • Box oven cure Test Method ATM-0018 ATM-0089 ATM-0067 ATM-0068 Test Description 10 x 10 mm S...

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84-1LMISR4 ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE - ETC

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