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CPC1777

IXYS
Part Number CPC1777
Manufacturer IXYS
Description Normally Open DC-Only Power Relay
Published Jul 23, 2016
Detailed Description INTEGRATED CIRCUITS DIVISION Characteristics Parameter Blocking Voltage Load Current, TA=25°C: With 5°C/W Heat Sink No ...
Datasheet PDF File CPC1777 PDF File

CPC1777
CPC1777


Overview
INTEGRATED CIRCUITS DIVISION Characteristics Parameter Blocking Voltage Load Current, TA=25°C: With 5°C/W Heat Sink No Heat Sink On-Resistance (max) Thermal Resistance, Junction-to-Case, JC Rating 600 4.
6 1.
5 0.
5 0.
35 Units VP ADC  °C/W Features • 4.
6ADC Load Current with 5°C/W Heat Sink • Low 0.
5On-Resistance • 600VP Blocking Voltage • 2500Vrms Input/Output Isolation • Low Thermal Resistance: JC = 0.
35 °C/W • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications • Low Drive Power Requirements • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Machine Insertable, Wave Solderable Applications • Industrial Controls / Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Utility Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense Approvals • UL 508 Certified Component: File E69938 Pin Configuration 12 +- 34 -+ e3 CPC1777 600V Single-Pole, Normally Open DC-Only Power Relay Description IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays.
As part of this new family, the CPC1777 single-pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.
The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED.
The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications.
The unique i4-PAC package pioneered by IXYS enables solid state relays to achieve the highest load current and power ratings.
This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual co...



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