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CPC1709

Clare
Part Number CPC1709
Manufacturer Clare
Description DC Power Relay
Published Jan 24, 2015
Detailed Description CPC1709 ISOPLUS™-264 DC Power Relay Parameter Blocking Voltage Load Current, TA=25ºC With 5°C/W Heat Sink No Heat Sink ...
Datasheet PDF File CPC1709 PDF File

CPC1709
CPC1709

Overview
CPC1709 ISOPLUS™-264 DC Power Relay Parameter Blocking Voltage Load Current, TA=25ºC With 5°C/W Heat Sink No Heat Sink On-resistance RθJC Rating 60 22.
8 9 0.
05 0.
3 Units VP ADC Ω ºC/W Features • 100% Solid State • Compact ISOPLUS-264 Power Package • Low Thermal Resistance (0.
3°C/W) • 22.
8ADC Load Current with 5°C/W Heat Sink • Electrically Non-conductive Thermal Pad for Heat Sink Applications • Low Drive Power Requirements • Arc-Free With No Snubbing Circuits • 2500Vrms Input/Output Isolation • No EMI/RFI Generation • Machine Insertable, Wave Solderable Applications • Industrial Controls • Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense Pin Configuration Description Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays.
As part of this new family, the CPC1709 single pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.
The output is constructed with an efficient MOSFET switch and photovoltaic die that uses Clare’s patented OptoMOS architecture while the input GaAlAs infrared LED provides the optically-coupled control.
The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications.
The unique ISOPLUS-264 package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings.
This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe.
The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low therm...


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