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CPC1708

Clare
Part Number CPC1708
Manufacturer Clare
Description DC Power Relay
Published Jan 24, 2015
Detailed Description CPC1708 i4-PAC™ DC Power Relay Parameters Blocking Voltage Load Current, TA=25ºC With 5°C/W Heat Sink No Heat Sink On-r...
Datasheet PDF File CPC1708 PDF File

CPC1708
CPC1708

Overview
CPC1708 i4-PAC™ DC Power Relay Parameters Blocking Voltage Load Current, TA=25ºC With 5°C/W Heat Sink No Heat Sink On-resistance RθJC Ratings 60 11.
85 4 0.
08 0.
35 Units VP ADC Ω ºC/W Features • 100% Solid State • Compact i4-PAC Power Package • Low Thermal Resistance (0.
35°C/W) • 11.
85ADC Load Current with 5ºC/W Heat Sink • Electrically Non-conductive Thermal Pad for Heat Sink Applications • Arc-Free With No Snubbing Circuits • 2500Vrms Input/Output Isolation • No EMI/RFI Generation • Machine Insertable, Wave Solderable Applications • Industrial Controls • Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Utility Meters (gas, oil, electric and water) • Transportation Equipment • Aerospace/Defense Pin Configuration Description Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays.
As part of this new family, the CPC1708 1-Form-A DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.
The output is constructed with an efficient MOSFET switch and photovoltaic die that use Clare’s patented OptoMOS architecture while the input GaAlAs infrared LED provides the optically-coupled control.
The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications.
The unique i4-PAC package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings.
This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe.
The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.
35°C/W).
Approvals • UL recognized ...


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