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BCP56-10

NXP
Part Number BCP56-10
Manufacturer NXP
Description NPN medium power transistors
Published Mar 23, 2005
Detailed Description DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BCP54; BCP55; BCP56 NPN medium power transistors Product spe...
Datasheet PDF File BCP56-10 PDF File

BCP56-10
BCP56-10

Overview
DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BCP54; BCP55; BCP56 NPN medium power transistors Product specification Supersedes data of 1997 Apr 08 1999 Apr 08 Philips Semiconductors Product specification NPN medium power transistors FEATURES • High current (max.
1 A) • Low voltage (max.
80 V).
APPLICATIONS • Switching.
DESCRIPTION NPN medium power transistor in a SOT223 plastic package.
PNP complements: BCP51, BCP52 and BCP53.
handbook, halfpage BCP54; BCP55; BCP56 PINNING PIN 1 2, 4 3 base collector emitter DESCRIPTION 4 2, 4 1 3 1 Top view 2 3 MAM287 Fig.
1 Simplified outline (SOT223) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL VCBO BCP54 BCP55 BCP56 VCEO collector-emitter voltage BCP54 BCP55 BCP56 VEBO IC ICM IBM Ptot Tstg Tj Tamb Note 1.
Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”.
emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation storage temperature junction temperature operating ambient temperature Tamb ≤ 25 °C; note 1 open collector open base − − − − − − − − −65 − −65 45 60 80 5 1 1.
5 0.
2 1.
33 +150 150 +150 V V V V A A A W °C °C °C PARAMETER collector-base voltage CONDITIONS open emitter − − − 45 60 100 V V V MIN.
MAX.
UNIT 1999 Apr 08 2 Philips Semiconductors Product specification NPN medium power transistors THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s Note PARAMETER thermal resistance from junction to ambient thermal resistance from junction to soldering point BCP54; BCP55; BCP56 CONDITIONS note 1 VALUE 94 13 UNIT K/W K/W 1.
Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbo...


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