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BCP52-16

NXP
Part Number BCP52-16
Manufacturer NXP
Description PNP medium power transistors
Published Mar 23, 2005
Detailed Description www.DataSheet4U.com DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BCP51; BCP52; BCP53 PNP medium power tr...
Datasheet PDF File BCP52-16 PDF File

BCP52-16
BCP52-16


Overview
www.
DataSheet4U.
com DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BCP51; BCP52; BCP53 PNP medium power transistors Product specification Supersedes data of 1997 Apr 08 1999 Apr 08 Philips Semiconductors Product specification PNP medium power transistors FEATURES • High current (max.
1 A) • Low voltage (max.
80 V) • Medium power (max.
1.
3 W).
APPLICATIONS • Audio, telephony and automotive applications • Thick and thin-film circuits.
DESCRIPTION PNP medium power transistor in a SOT223 plastic package.
NPN complements: BCP54, BCP55 and BCP56.
1 Top view handbook, halfpage BCP51; BCP52; BCP53 PINNING PIN 1 2, 4 3 base collector emitter DESCRIPTION 4 2, 4 1 3 2 3 MAM288 Fig.
1 Simplified outline (SOT223) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL VCBO BCP51 BCP52 BCP53 VCEO collector-emitter voltage BCP51 BCP52 BCP53 VEBO IC ICM IBM Ptot Tstg Tj Tamb Note 1.
Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”.
emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation storage temperature junction temperature operating ambient temperature Tamb ≤ 25 °C; note 1 open collector open base − − − − − − − − −65 − −65 −45 −60 −80 −5 −1 −1.
5 −0.
2 1.
3 +150 150 +150 V V V V A A A W °C °C °C PARAMETER collector-base voltage CONDITIONS open emitter − − − −45 −60 −100 V V V MIN.
MAX.
UNIT 1999 Apr 08 2 Philips Semiconductors Product specification PNP medium power transistors THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s Note PARAMETER thermal resistance from junction to ambient thermal resistance from junction to soldering point BCP51; BCP52; BCP53 CONDITIONS note 1 VALUE 95 14 UNIT K/W K/W 1.
Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for ...



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