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25Q256FVFF

Winbond
Part Number 25Q256FVFF
Manufacturer Winbond
Description 3V 256M-BIT SERIAL FLASH MEMORY
Published Dec 18, 2020
Detailed Description W25Q256FV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: December 02, 2014 Prelimina...
Datasheet PDF File 25Q256FVFF PDF File

25Q256FVFF
25Q256FVFF

Overview
W25Q256FV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: December 02, 2014 Preliminary - Revision G W25Q256FV Table of Contents 1.
GENERAL DESCRIPTIONS.
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5 2.
FEATURES 5 3.
PACKAGE TYPES AND PIN CONFIGURATIONS .
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6 3.
1 Pad Configuration WSON 8x6-mm .
6 3.
2 Pad Description WSON 8x6-mm 6 3.
3 Pin Configuration SOIC 300-mil .
7 3.
4 Pin Description SOIC 300-mil 7 3.
5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) .
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8 3.
6 Ball Description TFBGA 8x6-mm .
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8 4.
PIN DESCRIPTIONS 9 4.
1 Chip Select (/CS).
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9 4.
2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .
9 4.
3 Write Protect (/WP).
9 4.
4 HOLD (/HOLD) .
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9 4.
5 Serial Clock (CLK) .
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