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25Q256FV

Winbond
Part Number 25Q256FV
Manufacturer Winbond
Description 3V 256M-BIT SERIAL FLASH MEMORY
Published Dec 30, 2021
Detailed Description W25Q256FV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: February 26, 2016 Prelimina...
Datasheet PDF File 25Q256FV PDF File

25Q256FV
25Q256FV

Overview
W25Q256FV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: February 26, 2016 Preliminary Revision I W25Q256FV Table of Contents 1.
GENERAL DESCRIPTIONS.
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5 2.
FEATURES 5 3.
PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.
1 Pad Configuration WSON 8x6-mm .
6 3.
2 Pad Description WSON 8x6-mm 6 3.
3 Pin Configuration SOIC 300-mil .
7 3.
4 Pin Description SOIC 300-mil 7 3.
5 Pin Configuration PDIP 300-mil .
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8 3.
6 Pin Description SOIC 150/208-mil, WSON 6x5-mm / USON 4x3-mm / PDIP 300-mil .
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8 3.
7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) .
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9 3.
8 Ball Description TFBGA 8x6-mm .
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9 4.
PIN DESCRIPTIONS .
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10 4.
1 Chip Select (/CS) .
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10 4.
2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) 10 4.
3 Write Protect (/WP) .
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