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25Q256JWPQ

Winbond
Part Number 25Q256JWPQ
Manufacturer Winbond
Description 1.8V 256M-BIT SERIAL FLASH MEMORY
Published Dec 18, 2020
Detailed Description W25Q256JW 1.8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: December 08. 2017 - Revision B ...
Datasheet PDF File 25Q256JWPQ PDF File

25Q256JWPQ
25Q256JWPQ

Overview
W25Q256JW 1.
8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: December 08.
2017 - Revision B W25Q256JW Table of Contents 1.
GENERAL DESCRIPTIONS.
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5 2.
FEATURES 5 3.
PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.
1 Pad Configuration 6x5-mm/ 8x6-mm.
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6 3.
2 Pad Description WSON 6x5-mm/ 8x6-mm .
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6 3.
3 Pin Configuration SOIC 300-mil .
7 3.
4 Pin Description SOIC 300-mil 7 3.
5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) .
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8 3.
6 Ball Description TFBGA 8x6-mm .
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8 3.
7 Ball Configuration WLCSP .
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9 3.
8 Ball Description WLCSP.
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9 4.
PIN DESCRIPTIONS .
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10 4.
1 Chip Select (/CS) .
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10 4.
2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) 10 4.
3 Write Protect (/WP) .
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