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25Q256JWCM

Winbond

1.8V 256M-BIT SERIAL FLASH MEMORY

W25Q256JW 1.8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: December 08. 2017 - Revision B ...


Winbond

25Q256JWCM

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W25Q256JW 1.8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: December 08. 2017 - Revision B W25Q256JW Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 Pad Configuration 6x5-mm/ 8x6-mm.................................................................................... 6 3.2 Pad Description WSON 6x5-mm/ 8x6-mm .......................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 3.7 Ball Configuration WLCSP ................................................................................................... 9 3.8 Ball Description WLCSP.........................................................




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