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MJF15031

ON
Part Number MJF15031
Manufacturer ON
Description COMPLEMENTARY SILICON POWER TRANSISTORS
Published May 7, 2005
Detailed Description MJF15030 (NPN), MJF15031 (PNP) Complementary Power Transistors For Isolated Package Applications Designed for general−...
Datasheet PDF File MJF15031 PDF File

MJF15031
MJF15031

Overview
MJF15030 (NPN), MJF15031 (PNP) Complementary Power Transistors For Isolated Package Applications Designed for general−purpose amplifier and switching applications, where the mounting surface of the device is required to be electrically isolated from the heatsink or chassis.
Features • Electrically Similar to the Popular MJE15030 and MJE15031 • No Isolating Washers Required, Reduced System Cost • High Current Gain−Bandwidth Product • UL Recognized, File #E69369, to 3500 VRMS Isolation • These Devices are Pb−Free and are RoHS Compliant* MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage Collector−Base Voltage Emitter−Base Voltage RMS Isolation Voltage (Note 1) (t = Per 0.
3 sec, R.
H.
Figure 11 ≤ 30%, TA = 25_C) VCEO VCB VEB VISOL 150 150 5 4500 Vdc Vdc Vdc VRMS Collector Current − Continuous Collector Current − Peak Base Current Total Power Dissipation Derate above 25_C (Note 2) @ TC = 25_C Total Power Dissipation Derate above 25_C @ TA = 25_C Operating and Storage Temperature Range THERMAL CHARACTERISTICS IC ICM IB PD PD TJ, Tstg 8 16 2 36 0.
286 2.
0 0.
016 –65 to +150 Adc Adc Adc W W/_C W W/_C _C Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Ambient RqJA 62.
5 _C/W Thermal Resistance, Junction−to−Case (Note 2) RqJC 3.
5 _C/W Lead Temperature for Soldering Purposes TL 260 _C Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
Proper strike and creepage distance must be provided.
2.
Measurement made with thermocouple contacting the bottom insulated surface (in a location beneath the die), the devices mounted on a heatsink with thermal grease and a mounting torque of ≥ 6 in.
lbs.
*For additional information on our Pb−Free strategy and soldering details, please ...


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