DatasheetsPDF.com

AM42DL16X4D

SPANSION
Part Number AM42DL16X4D
Manufacturer SPANSION
Description Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Published Sep 7, 2006
Detailed Description www.DataSheet4U.com Am42DL16x4D Data Sheet July 2003 The following document specifies Spansion memory products that ar...
Datasheet PDF File AM42DL16X4D PDF File

AM42DL16X4D
AM42DL16X4D

Overview
www.
DataSheet4U.
com Am42DL16x4D Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu.
Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications There is no change to this datasheet as a result of offering the device as a Spansion product.
Any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported.
Future routine revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”.
To order these products, please use only the Ordering Part Numbers listed in this document.
DataShee For More Information DataSheet4U.
com Please contact your local AMD or Fujitsu sales office for additional information about Spansion memory solutions.
Publication Number 25790 Revision A Amendment 0 Issue Date January 9, 2002 DataSheet4U.
com DataSheet 4 U .
com www.
DataSheet4U.
com PRELIMINARY Am42DL16x4D Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am29DL16xD 16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.
0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (256 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features s Power supply voltage of 2.
7 to 3.
3 volt s High performance — Access time as fast as 70 ns SOFTWARE FEATURES s Data Management Software (DMS) — AMD-supplied software manages data programming and erasing, enabling EEPROM emulation — Eases sector erase limitations s Package — 69-Ball FBGA s Supports Common Flash Memory Interface (CFI) s Erase Suspend/Erase Resume — Suspends erase operations to allow programming in same bank s Operating Temperature — –40°C to +85°C Flash Memory Feature...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)