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AM42DL16X2D

AMD
Part Number AM42DL16X2D
Manufacturer AMD
Description Simultaneous Operation Flash Memory
Published May 17, 2007
Detailed Description Am42DL16x2D Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both...
Datasheet PDF File AM42DL16X2D PDF File

AM42DL16X2D
AM42DL16X2D

Overview
Am42DL16x2D Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu.
Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications There is no change to this datasheet as a result of offering the device as a Spansion product.
Any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported.
Future routine revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”.
To order these products, please use only the Ordering Part Numbers listed in this document.
For More Information Please contact your local AMD or Fujitsu sales office for additional information about Spansion memory solutions.
Publication Number 25561 Revision A Amendment +2 Issue Date February 6, 2004 THIS PAGE LEFT INTENTIONALLY BLANK.
Am42DL16x2D Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am29DL16xD 16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.
0 Volt-only, Simultaneous Operation Flash Memory and 2 Mbit (128 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features ■ Power supply voltage of 2.
7 to 3.
3 volt ■ High performance — Access time as fast as 70 ns SOFTWARE FEATURES ■ Data Management Software (DMS) — AMD-supplied software manages data programming and erasing, enabling EEPROM emulation — Eases sector erase limitations ■ Package — 69-Ball FBGA ■ Supports Common Flash Memory Interface (CFI) ■ Erase Suspend/Erase Resume — Suspends erase operations to allow programming in same bank ■ Operating Temperature — –40°C to +85°C Flash Memory Features ARCHITECTURAL ADVANTAGES ■ Simultaneous Read/Write operations — Data can be co...


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