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QFP-EP

STATS ChipPAC
Part Number QFP-EP
Manufacturer STATS ChipPAC
Description Exposed Pad Quad Flat Pack
Published Oct 23, 2006
Detailed Description www.DataSheet4U.com QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead p...
Datasheet PDF File QFP-EP PDF File

QFP-EP
QFP-EP

Overview
www.
DataSheet4U.
com QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.
80mm to 0.
40mm FEATURES • Body Sizes: 7 x 7mm to 24 x 24mm • Package Height: 1.
0mm (TQFP-ep) and 1.
4mm (LQFP-ep) • Lead Counts: 32L to 216L • Lead Pitch: 0.
40mm to 0.
80mm • Wide range of open tool leadframe and die pad sizes available • JEDEC standard compliant • Lead-free and Green material sets available DESCRIPTION STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package.
Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding.
STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin QFP (TQFP-ep).
These enhanced thermal packages are made possible by deep downset die pad leadframe design combined with well controlled low loop wirebonding and package warpage control during the molding process.
APPLICATIONS • ASIC • DSP • Gate Array • Logic, Microprocessors/Controllers • Multimedia, PC Chipsets, Others DataSheet 4 U .
com www.
statschippac.
com www.
DataSheet4U.
com QFP-ep Exposed Pad Quad Flat Pack SPECIFICATIONS Die Thickness Gold Wire Lead Finish Marking Packing Options 304-482µm (12-19mils) range preferred 25/30µm (1.
0/1.
2mils) diameter, 99.
999% Au 85/15 Sn/Pb or Matte Tin Laser/ink JEDEC tray/tape and reel RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal Shock (opt) JEDEC Level 3 -65°C/150°C, 1000 cycles 150°C, 500 hrs 121°C 100% RH, 2 atm, 168 hrs -55°C/125°C, 1000 cycles THERMAL PERFORMANCE, θja (°C/W) Package 48L 64L 80L Body Size (mm) 7 x 7 x 1.
0 10 x 10 x 1.
0 12 x 12 x 1.
0 Pad Size (mm) 5.
5 x 5.
5 6.
5 x 6.
5 7.
2 x 7.
2 Die Size (mm) 5.
3 x 5.
3 6.
0 x 6.
0 6.
0 x 6.
0 PCB Vias 25 36 36 Thermal Performance, θja (°C/W) 26.
9 24.
0 23.
0 Note: Simulation data for package mount...


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