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QFP-SD

STATS ChipPAC
Part Number QFP-SD
Manufacturer STATS ChipPAC
Description Stacked Die Quad Flat Pack
Published Oct 23, 2006
Detailed Description www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a...
Datasheet PDF File QFP-SD PDF File

QFP-SD
QFP-SD

Overview
www.
DataSheet4U.
com QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES • Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips into a single package • Die to die bonding capability for device/signal integration • Standard and green/lead-free materials and Pb-free plating • Options for mixed technologies, 2 or more stacked dice • Fine pitch bonding capability • Exposed pad provides enhanced thermal performance • Low profile package thickness of 1.
40mm (LQFP-SD and LQFP-ep-SD); 1.
00mm (TQFP-ep-SD) • Lead pitch ranges from 0.
80mm to 0.
40mm • Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD) • JEDEC standard compliant package outlines DESCRIPTION STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.
LQFP-SD is a stacked die low profile QFP.
LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance.
TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance.
STATS ChipPAC’s chip stacking technology allows the integration of multiple ICs within a single package to improve package performance and functionality while reducing overall package size and cost.
The die to die wire bonding capability enables device/signal integration to improve electrical performance and reduce overall package I/O requirements.
STATS ChipPAC’s Stacked Die QFPs with nominal package thickness of 1.
40mm and 1.
00mm are suitable for a variety of product applications.
Stacked Die QFP packages are currently available in LQFP, LQFP-ep and TQFP-ep configurations, and are offered in standard and green/lead-free bill of materials.
APPLICATIONS Suitable for a variety of applications including memory integration (ASIC or Logic), chipset integration (Analog/ Digital), mixed technologies integration (Baseband/RF), h...


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