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STP9NB50FP

ST Microelectronics
Part Number STP9NB50FP
Manufacturer ST Microelectronics
Description PowerMesh MOSFET
Published Sep 14, 2009
Detailed Description N-CHANNEL 500V - 0.75 Ω - 8.6 A TO-220/TO-220FP PowerMesh™ MOSFET TYPE STP9NB50 STP9NB50FP s s s s s STP9NB50 STP9NB50F...
Datasheet PDF File STP9NB50FP PDF File

STP9NB50FP
STP9NB50FP

Overview
N-CHANNEL 500V - 0.
75 Ω - 8.
6 A TO-220/TO-220FP PowerMesh™ MOSFET TYPE STP9NB50 STP9NB50FP s s s s s STP9NB50 STP9NB50FP VDSS 500 V 500 V RDS(on) < 0.
85 Ω < 0.
85 Ω ID 8.
6 A 4.
9 A TYPICAL RDS(on) = 0.
75 Ω EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED VERY LOW INTRINSIC CAPACITANCES GATE CHARGE MINIMIZED 3 1 2 1 2 3 TO-220 TO-220FP DESCRIPTION Using the latest high voltage MESH OVERLAY™ process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances.
The new patent pending strip layout coupled with the Company’s proprieraty edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.
APPLICATIONS s HIGH CURRENT, HIGH SPEED SWITCHING s SWITH MODE POWER SUPPLIES (SMPS) s DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVE ABSOLUTE MAXIMUM RATINGS Symbol VDS VDGR VGS ID ID IDM (q) PTOT dv/dt (1) VISO Tstg Tj Parameter Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100° C Drain Current (pulsed) Total Dissipation at TC = 25°C Derating Factor Peak Diode Recovery voltage slope Insulation Withstand Voltage (DC) Storage Temperature Max.
Operating Junction Temperature INTERNAL SCHEMATIC DIAGRAM Value STP9NB50 500 500 ±30 8.
6 5.
4 34.
4 125 1 4.
5 –65 to 150 150 (1)ISD<9A, di/dt<200A/µ, VDD9 3.
1 34.
4 40 0.
32 4.
5 2000 A A A W W/ °C V/ns V °C °C (•)Pulse width limited by safe operating area May 2000 1/9 STP9NB50/FP THERMAL DATA TO-220 Rthj-case Rthj-amb Rthc-sink Tl Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose 1 62.
5 0.
5 300 TO-220FP 3.
13 ° C/W ° C/W ° C/W °C AVALANCHE CHARACTERISTICS Symbol IAR EAS Parameter Aval...


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