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FDMF6704V

Fairchild Semiconductor
Part Number FDMF6704V
Manufacturer Fairchild Semiconductor
Description High Frequency DrMOS Module
Published Oct 14, 2009
Detailed Description FDMF6704V - XSTM DrMOS with Internal 5V Regulator August 2009 FDMF6704V - XSTM DrMOS The Xtra Small, High Performance,...
Datasheet PDF File FDMF6704V PDF File

FDMF6704V
FDMF6704V

Overview
FDMF6704V - XSTM DrMOS with Internal 5V Regulator August 2009 FDMF6704V - XSTM DrMOS The Xtra Small, High Performance, High Frequency DrMOS Module with LDO Benefits General Description Single 12 V power supply operation.
Ultra compact size - 6 mm x 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm x 8 mm DrMOS packages.
Ultra compact thermally enhanced 6 mm x 6 mm MLP package 84 % smaller than conventional discrete solutions.
Fully optimized system efficiency.
Clean voltage waveforms with reduced ringing.
High frequency operation.
Compatible with a wide variety of PWM controllers in the market.
Single input voltage operation.
tm Features Internal 12 V to 5 V regulator.
Synchronous driver plus FET multichip module.
High current handling of 35 A.
Over 93 % peak efficiency.
Tri-State PWM input.
Fairchild's PowerTrench® 5 technology MOSFETs for clean voltage waveforms and reduced ringing.
Optimized for high switching frequencies of up to 1 MHz.
Skip mode SMOD [low side gate turn off] input.
Fairchild SyncFETTM [integrated Schottky diode] technology in the low side MOSFET.
Integrated bootstrap Schottky diode.
Adaptive gate drive timing for shoot-through protection.
Driver output disable function [DISB# pin].
Undervoltage lockout (UVLO).
Fairchild Green Packaging and RoHS compliant.
Low profile SMD package.
The XSTM DrMOS family is Fairchild’s next-generation fullyoptimized, ultra-compact, integrated MOSFET plus driver power stage solutions for high current, high frequency synchronous buck DC-DC applications.
The FDMF6704V XSTM DrMOS integrates a driver IC, two power MOSFETs and a bootstrap Schottky diode along with an integrated 5 V gate drive LDO regulator into a thermally enhanced, ultra compact 6 mm x 6 mm MLP package.
With an integrated approach, the complete switching power stage is optimized with regards to driver and MOSFET dynamic performance, system inductance and RDS(ON).
This greatly reduces the package parasitics and layout challenges associa...


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