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BGA2800

NXP
Part Number BGA2800
Manufacturer NXP
Description MMIC Wideband Amplifier
Published Oct 23, 2010
Detailed Description BGA2800 MMIC wideband amplifier Rev. 5 — 13 July 2015 Product data sheet 1. Product profile 1.1 General description S...
Datasheet PDF File BGA2800 PDF File

BGA2800
BGA2800

Overview
BGA2800 MMIC wideband amplifier Rev.
5 — 13 July 2015 Product data sheet 1.
Product profile 1.
1 General description Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package.
1.
2 Features and benefits  Internally matched to 50   A gain of 20 dB at 250 MHz increasing to 20.
6 dB at 2150 MHz  Output power at 1 dB gain compression = 1 dBm  Supply current = 10.
5 mA at a supply voltage of 3.
3 V  Reverse isolation > 30 dB up to 2 GHz  Good linearity with low second order and third order products  Noise figure = 4 dB at 950 MHz  Unconditionally stable (K > 1) 1.
3 Applications  LNB IF amplifiers  General purpose low noise wideband amplifier for frequencies between DC and 2.
2 GHz 2.
Pinning information Table 1.
Pin 1 2, 5 3 4 6 Pinning Description VCC GND2 RF_OUT GND1 RF_IN Simplified outline Graphic symbol        V\P NXP Semiconductors BGA2800 MMIC wideband amplifier 3.
Ordering information Table 2.
Ordering information Type number Package Name Description BGA2800 - plastic surface-mounted package; 6 leads Version SOT363 4.
Marking Table 3.
Marking Type number BGA2800 Marking code *E7 Description * = - : made in Hong Kong * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia 5.
Limiting values Table 4.
Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions VCC ICC Ptot Tstg Tj Pdrive supply voltage supply current total power dissipation storage temperature junction temperature drive power RF input AC coupled Tsp = 90 C 6.
Thermal characteristics Min Max Unit 0.
5 +5.
0 V - 55 mA - 200 mW 40 +125 C - 125 C - +10 dBm Table 5.
Symbol Rth(j-sp) Thermal characteristics Parameter Conditions thermal resistance from junction to Ptot = 200 mW; Tsp = 90 C solder point Typ Unit 300 K/W 7.
Characteristics Table 6.
Characteristics VCC = 3.
3 ...


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