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TC3133

TRANSCOM
Part Number TC3133
Manufacturer TRANSCOM
Description 2.4 GHz 1W MMIC
Published Mar 11, 2011
Detailed Description TC3133 REV2_20031121 2.4 GHz 1W MMIC FEATURES • • • • • P-1 dB: 31 dBm Small Signal Gain: 24 dB Power Added Efficiency:...
Datasheet PDF File TC3133 PDF File

TC3133
TC3133

Overview
TC3133 REV2_20031121 2.
4 GHz 1W MMIC FEATURES • • • • • P-1 dB: 31 dBm Small Signal Gain: 24 dB Power Added Efficiency: 30 % IP3: 39 dBm Bias Condition: 600 mA @ 5 V PHOTO ENLARGEMENT Vg NA RF IN GND GND RF OUT RF OUT Vd DESCRIPTION The TC3133 is a 2 stage PHEMT MMIC power amplifier.
It is designed for use in low cost and high volume 2.
4-2.
5 GHz ISM band applications.
The MMIC provides a typical gain of 24 dB and saturation power of more than 31 dBm.
Typical bias condition is 5V at 600 mA.
The MMIC is packaged in a standard SO-8 power package.
The copper based carrier of the package allows direct soldering of the device to the PCB for proper heat sinking.
The input and output matching of the MMIC require external components.
ELECTRICAL SPECIFICATIONS (Ta = 25 °C) SYMBOL FREQ SSG P-1 dB P-3 dB IP3 VSWR, IN VDD Vg IDD IDP-1 DESCRIPTION Frequency Range Small Signal Gain Output Power at 1 dB Gain Compression Output Power at 3 dB Gain Compression Third Order Intercept Point Input VSWR Supply Voltage Gate Voltage Current Supply Without RF Current Supply @ Pout = P-1 dB Power Added Efficiency -0.
6 MIN 2.
4 22 30 31 37 24 31 32 39 2:1 5 -1.
2 600 800 30 -2 TYP MAX 2.
5 UNITS GHz dB dBm dBm dBm Volt Volt mA mA % www.
DataSheet4U.
com ηa TRANSCOM, INC.
, 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.
O.
C.
Web-Site: www.
transcominc.
com.
tw Phone: 886-6-5050086 Fax: 886-6-5051602 P1/3 TC3133 REV2_20031121 TEST CIRCUITS Evaluation Board Schematic EVALUATION BOARD PCB Material: FR4 ER = 4.
6 Thickness = 31 mil Unit: mil * DXF file of the PCB can be downloaded from our web-site at www.
transcominc.
com.
tw * Application Notes: For better heat sinking and grounding, it's recommended to have the via holes beneath TC3133 filled with solder and have two screws installed on required heat sink plate besides TC3133 on the PCB area.
www.
DataSheet4U.
com TRANSCOM, INC.
, 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She...


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