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TC3139

TRANSCOM
Part Number TC3139
Manufacturer TRANSCOM
Description 2.3 - 2.5 GHz 1W MMIC
Published Mar 11, 2011
Detailed Description TC3139 REV.2_04/12/2004 2.3 - 2.5 GHz 1W MMIC FEATURES • • • • • • P-1 dB: 30 dBm Small Signal Gain: 26 dB Power Added ...
Datasheet PDF File TC3139 PDF File

TC3139
TC3139

Overview
TC3139 REV.
2_04/12/2004 2.
3 - 2.
5 GHz 1W MMIC FEATURES • • • • • • P-1 dB: 30 dBm Small Signal Gain: 26 dB Power Added Efficiency: 32 % IP3: 40 dBm Matched to 50 Ω operation Bias condition: 400 mA @ 7 V PHOTO ENLARGEMENT DESCRIPTION The TC3139 is a 2 stage PHEMT MMIC power amplifier.
It is designed for use in low cost, high volume, 2.
3 –2.
5 GHz band applications.
The MMIC provides a typical gain of 26 dB and P1dB power of more than 30 dBm.
Typical bias condition is 7V at 400 mA.
The MMIC is packaged in a low-cost surface-mountable plastic package.
The input and output matching of the MMIC require minimum external components.
APPLICATIONS • • • Wireless Internet Access Wireless Local Loop Two way radio ELECTRICAL SPECIFICATIONS (Ta = 25 °C) SYMBOL DESCRIPTION Frequency Range FREQ Small Signal Gain SSG Small Signal Gain Flatness GOF Output Power at 1 dB Gain Compression P-1 dB Output Power at 3 dB Gain Compression P-3 dB Third Order Intercept Point IP3 Input VSWR VSWR, IN Supply Voltage VDD www.
DataSheet4U.
com Gate Voltage Vg Current Supply Without RF IDD Current Supply @ Pout=P-1 dB IDP-1 Power Added Efficiency ηa MIN 2.
3 25 29 30 38 TYP 26 ±0.
5 30 31 40 2:1 7 -1.
0 400 450 32 MAX 2.
5 ±0.
75 dBm dBm dBm Volt Volt mA mA % UNITS GHz dB -0.
6 -1.
5 TRANSCOM, INC.
, 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.
O.
C.
Web-Site: www.
transcominc.
com.
tw Phone: 886-6-5050086 Fax: 886-6-5051602 P1/4 TC3139 REV.
2_04/12/2004 TEST CIRCUITS Evaluation Board Schematic EVALUATION BOARD DXF file of the PCB can be downloaded from our web-site at www.
transcominc.
com.
tw PCB Material: FR4 ER = 4.
6 Thickness = 32 mil Unit: mil Application Notes: For better heat sinking and grounding, it's recommended to have the via holes beneath TC3139 filled with solder and have two screws besides TC3139 installed on the PCB area.
www.
DataSheet4U.
com + TRANSCOM, INC.
, 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, ...


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