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NTD18N06

ON Semiconductor
Part Number NTD18N06
Manufacturer ON Semiconductor
Description Power MOSFET
Published Nov 17, 2013
Detailed Description NTD18N06 Power MOSFET 18 Amps, 60 Volts N−Channel DPAK Designed for low voltage, high speed switching applications in po...
Datasheet PDF File NTD18N06 PDF File

NTD18N06
NTD18N06

Overview
NTD18N06 Power MOSFET 18 Amps, 60 Volts N−Channel DPAK Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.
Features http://onsemi.
com V(BR)DSS 60 V RDS(on) TYP 51 mW N−Channel D ID MAX 18 A • Pb−Free Packages are Available Typical Applications • • • • Power Supplies Converters Power Motor Controls Bridge Circuits G S Value 60 60 "20 "30 18 10 54 55 0.
36 2.
1 − 55 to +175 72 Adc Apk W W/°C W °C mJ 4 DPAK−3 CASE 369D STYLE 2 Unit Vdc Vdc Vdc VGS VGS ID ID 4 1 2 MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Drain−to−Source Voltage Drain−to−Gate Voltage (RGS = 10 MW) Gate−to−Source Voltage − Continuous − Non−repetitive (tpv10 ms) Drain Current − Continuous @ TA = 25°C − Continuous @ TA = 100°C − Single Pulse (tpv10 ms) Total Power Dissipation @ TA = 25°C Derate above 25°C Total Power Dissipation @ TA = 25°C (Note 2) Operating and Storage Temperature Range Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 50 Vdc, VGS = 5.
0 Vdc, L = 1.
0 mH, IL(pk) = 12 A, VDS = 60 Vdc) Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2) Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds Symbol VDSS VDGR MARKING DIAGRAMS 4 Drain DPAK CASE 369C STYLE 2 YWW 18 N06G 2 1 3 Drain Gate Source 4 Drain YWW 18 N06G 1 2 3 Gate Drain Source 18N06 Y WW G = Device Code = Year = Work Week = Pb−Free Device Free Datasheet http://www.
datasheet4u.
com/ IDM PD 3 TJ, Tstg EAS RqJC RqJA RqJA TL 2.
73 100 71.
4 260 °C/W 1 2 3 °C Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
When surface mounted to an FR−4 board using the minimum recommended pad size.
2.
When surface moun...


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