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SIGC101T170R3E

Infineon
Part Number SIGC101T170R3E
Manufacturer Infineon
Description IGBT
Published Feb 14, 2016
Detailed Description SIGC101T170R3E IGBT3 Power Chip Features:  1700V Trench & Field Stop technology  low turn-off losses  short tail cu...
Datasheet PDF File SIGC101T170R3E PDF File

SIGC101T170R3E
SIGC101T170R3E

Overview
SIGC101T170R3E IGBT3 Power Chip Features:  1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules Applications:  drives Chip Type VCE IC Die Size SIGC101T170R3E 1700V 75A 10.
03 x 10.
03 mm2 C G E Package sawn on foil Mechanical Parameters Raster size Emitter pad size (incl.
gate pad) Gate pad size Area total Thickness Wafer size Max.
possible chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size Recommended storage environment 10.
03 x 10.
03 8 x ( 3.
82 x 1.
75 ) 1.
309 x 0.
844 mm2 100.
6 190 µm 200 mm 258 Photoimide 3200 nm AlSiCu Ni Ag –system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, <500µm  0.
65mm ; max 1.
2mm Store in original container, in dry nitrogen, in dark environment, < 6 month at an ambient temperature of 23°C Edited by INFINEON Technologies, IFAG IPC TD VLS, L7777M, L7777T, L7777E, Rev 2.
2, 01.
07.
2014 SIGC101T170R3E Maximum Ratings Parameter Symbol Value Unit Collector-Emitter voltage, Tvj =25 C DC collector current, limited by Tvj max VCE IC 1700 1) V A Pulsed collector current, tp limited by Tvj max Ic,puls 225 A Gate emitter voltage VGE 20 V Junction temperature range Operating junction temperature Short circuit data 2 ) VGE = 15V, VCC = 1000V, Tvj = 150°C Tvj Tvj tSC -40 .
.
.
+175 -40.
.
.
+150 10 °C C µs Reverse bias safe operating area 2 ) (RBSOA) 1 ) depending on thermal properties of assembly I C , m a x = 150A, V C E , m a x = 1700V Tvj  1 5 0 ° C 2 ) not subject to production test - verified by design/characterization Static Characteristic (tested on wafer), Tvj =25 C Parameter Symbol Conditions Value Unit min.
typ.
max.
Collector-Emitter breakdown voltage Collector-Emitter saturation voltage Gate-Emitter threshold voltage Zero gate voltage collector current Gate-Emitter leakage current...


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