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BUW11AF

NXP
Part Number BUW11AF
Manufacturer NXP
Description Silicon diffused power transistors
Published Mar 23, 2005
Detailed Description DISCRETE SEMICONDUCTORS DATA SHEET BUW11F; BUW11AF Silicon diffused power transistors Product specification Supersedes ...
Datasheet PDF File BUW11AF PDF File

BUW11AF
BUW11AF

Overview
DISCRETE SEMICONDUCTORS DATA SHEET BUW11F; BUW11AF Silicon diffused power transistors Product specification Supersedes data of February 1996 File under Discrete Semiconductors, SC06 1997 Aug 14 Philips Semiconductors Product specification Silicon diffused power transistors DESCRIPTION High-voltage, high-speed, glass-passivated NPN power transistor in a SOT199 package.
APPLICATIONS • Converters • Inverters • Switching regulators • Motor control systems.
PINNING PIN 1 2 3 mb DESCRIPTION base collector emitter mounting base; electrically isolated Front view MSB012 BUW11F; BUW11AF ook, halfpage handbook, halfpage 2 1 MBB008 3 1 2 3 Fig.
1 Simplified outline (SOT199) and symbol.
QUICK REFERENCE DATA SYMBOL VCESM BUW11F BUW11AF VCEO collector-emitter voltage BUW11F BUW11AF VCEsat ICsat collector-emitter saturation voltage collector saturation current BUW11F BUW11AF IC ICM Ptot tf collector current (DC) collector current (peak value) total power dissipation fall time see Figs 2 and 4 tp < 20 ms; see Fig.
2 Th ≤ 25 °C; see Fig.
3 resistive load; see Figs 8 and 9 3 2.
5 5 10 32 0.
8 A A A A W µs open base 400 450 1.
5 V V V PARAMETER collector-emitter peak voltage VBE = 0 850 1000 V V CONDITIONS MAX.
UNIT 1997 Aug 14 2 Philips Semiconductors Product specification Silicon diffused power transistors THERMAL CHARACTERISTICS SYMBOL Rth j-h Rth j-a Notes 1.
Mounted without heatsink compound and 30 ±5 N force on centre of package.
2.
Mounted with heatsink compound and 30 ±5 N force on centre of package.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL VCESM PARAMETER collector-emitter peak voltage BUW11F BUW11AF VCEO collector-emitter voltage BUW11F BUW11AF ICsat collector saturation current BUW11F BUW11AF IC ICM IB IBM Ptot Tstg Tj Notes 1.
Mounted without heatsink compound and 30 ±5 N force on centre of package.
2.
Mounted with heatsink compound and 30 ±5 N force on centre of package.
ISOLATION CHARACTERISTICS SYMBOL VisolM Cisol...


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