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RMPA1963

Fairchild Semiconductor
Part Number RMPA1963
Manufacturer Fairchild Semiconductor
Description CDMA2000-1X and WCDMA Power Amplifier Module
Published Mar 9, 2007
Detailed Description www.DataSheet4U.com RMPA1963 PRELIMINARY May 2005 RMPA1963 i-Lo™ US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier ...
Datasheet PDF File RMPA1963 PDF File

RMPA1963
RMPA1963

Overview
www.
DataSheet4U.
com RMPA1963 PRELIMINARY May 2005 RMPA1963 i-Lo™ US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features ■ 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMA/WCDMA efficiency (85 mA total current) at +16 dBm Pout ■ Meets HSDPA performance requirements ■ Linear operation in low-power mode up to +19 dBm ■ Low quiescent current (Iccq): 25 mA in low-power mode ■ Single positive-supply operation with low power and shutdown modes • 3.
4V typical Vcc operation • Low Vref (2.
85V) compatible with advanced handset chipsets ■ Compact Lead-free compliant LCC package – (4.
0 X 4.
0 x 1.
5 mm nominal) ■ Industry standard pinout ■ Internally matched to 50 Ohms and DC blocked RF input/output ■ Meets IS-95/CDMA2000-1XRTT/WCDMA performance requirements i L o ™ US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module (Preliminary) General Description The RMPA1963 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local Loop (WLL) applications.
Answering the call for ultra-low DC power consumption and extended battery life in portable electronics, the RMPA1963 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (< +16 dBm), where the handset most often operates.
A simple two-state Vmode control is all that is needed to reduce operating current by more than 50% at 16 dBm output power, and quiescent current (Iccq) by as much as 70% compared to traditional power-saving methods.
No additional circuitry, such as DC-to-DC converters, are required to achieve this remarkable improvement in amplifier efficiency.
Further, the 4x4x1.
5 mm LCC package is pin-compatible and a drop-in replacement for last generation 4x4 mm PAMs widely used today, minimizing the design time to apply this performanceenhancing technology.
The multi-stage GaAs Microwave Monolithic Integrated Circuit (MMIC) is manufactured using Fa...


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