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K9F1G08U0D

Samsung
Part Number K9F1G08U0D
Manufacturer Samsung
Description 1Gb NAND Flash
Published Mar 19, 2014
Detailed Description Rev. 1.1, Nov. 2010 K9F1G08U0D 1Gb NAND Flash Single-Level-Cell (1bit/cell) datasheet SAMSUNG ELECTRONICS RESERVES TH...
Datasheet PDF File K9F1G08U0D PDF File

K9F1G08U0D
K9F1G08U0D


Overview
Rev.
1.
1, Nov.
2010 K9F1G08U0D 1Gb NAND Flash Single-Level-Cell (1bit/cell) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only.
All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics.
No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2010 Samsung Electronics Co.
, Ltd.
All rights reserved.
-1Free Datasheet http://www.
Datasheet4U.
com K9F1G08U0D datasheet History 1.
Initial issue 1.
Max tR value has changed from 35us to 40us 2.
Min tRC/ tWC value has changed from 30ns to 25ns 3.
Chapter 2.
9, 2.
10 AC parameters revised 4.
Chapter 2.
3 ISB2 MAX value has changed from 50 to 80 5.
Chapter 2.
6 Capacitance value has changed from 8 to 10 1.
FBGA pkg code change H->B 2.
Device code(4th Cycle) has changed from 15h to 95h 3.
Chapter 1.
5.
1 63ball FBGA pkg dimension has changed.
1.
Chapter 2.
4 NOTE is Amendment.
2.
Chapter 1.
4.
1 PACKAGE DIMENSIONS revised.
3.
Chapter 1.
5 Pin Configuration (FBGA) revised.
Draft Date Dec.
09, 2009 May.
03, 2010 Rev.
1.
1 FLASH MEMORY Revision History Revision No.
0.
0 0.
1 Remark Advance Advance ...



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