DatasheetsPDF.com

74HCU04

NXP
Part Number 74HCU04
Manufacturer NXP
Description Hex unbuffered inverter
Published Apr 7, 2016
Detailed Description 74HCU04 Hex unbuffered inverter Rev. 7 — 8 December 2015 Product data sheet 1. General description The 74HCU04 is a h...
Datasheet PDF File 74HCU04 PDF File

74HCU04
74HCU04

Overview
74HCU04 Hex unbuffered inverter Rev.
7 — 8 December 2015 Product data sheet 1.
General description The 74HCU04 is a hex unbuffered inverter.
Inputs include clamp diodes.
This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
2.
Features and benefits  Complies with JEDEC standard JESD7A  Balanced propagation delays  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  Multiple package options  Specified from 40 C to +125 C 3.
Ordering information Table 1.
Ordering information Type number Package Temperature range Name Description Version 74HCU04D 40 C to +125 C SO14 plastic small outline package; 14 leads; body width 3.
9 mm SOT108-1 74HCU04DB 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body width SOT337-1 5.
3 mm 74HCU04PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.
4 mm SOT402-1 74HCU04BQ 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin SOT762-1 quad flat package; no leads; 14 terminals; body 2.
5  3  0.
85 mm NXP Semiconductors 4.
Functional diagram 74HCU04 Hex unbuffered inverter  $  $  $  $  $  $ <  <  <  <  <  <  PQD Fig 1.
Logic symbol               PQD Fig 2.
IEC logic symbol 5.
Pinning information $< PQD Fig 3.
Logic diagram (one inverter) $ < $ < $ < *1'        +&8  9&&  $  <  $  <  $  < DDO Fig 4.
Pin configuration SO14 and (T)SSOP14 +&8  $  9&& WHUPLQDO LQGH[DUHD <  $  <  $  <  9&&   $  <  $  <  $ *1'  <  DDO 7UDQVSDUHQWWRSYLHZ (1) This is not a supply pin.
The substrate is attached to this pad using conductive die attach material.
There is no electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain floating or be con...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)